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Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs.

Yuki MiwaSungho LeeRui LiangKousei KumaharaHisashi KinoTakafumi FukushimaTetsu Tanaka
Published in: 3DIC (2019)
Keyphrases
  • high speed
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