Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing.
Takafumi FukushimaShinichi SakuyamaMasatomo TakahashiHiroyuki HashimotoJichoel BeaTheodorus MarcelloHisashi KinoTetsu TanakaMitsumasa KoyanagiMariappan MurugesanPublished in: 3DIC (2021)