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Chip-level TSV integration for rapid prototyping of 3D system LSIs.
Kazuyuki Hozawa
Futoshi Furuta
Yuko Hanaoka
Mayu Aoki
Kenichi Takeda
Katsuyuki Sakuma
Kang Wook Lee
Takafumi Fukushima
Mitsumasa Koyanagi
Published in:
3DIC (2011)
Keyphrases
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rapid prototyping
visual programming
higher level
development environment
manufacturing processes
high speed
agent oriented programming
low cost
user interface
high density
real world
web pages
knowledge base
physical design
simulation platform