Kazuyuki Hozawa

Publication Activity (10 Years)

Years Active: 2010-2011
Publications (10 Years): 0

Publications

Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda
Void reduction in wafer bonding by simultaneously formed ventilation channels. 3DIC (2011)
Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi
Chip-level TSV integration for rapid prototyping of 3D system LSIs. 3DIC (2011)
Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda
Wafer-level hybrid bonding technology with copper/polymer co-planarization. 3DIC (2010)