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Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology.

Mariappan MurugesanJichel BeaTakafumi FukushimaMakoto MotoyoshiTetsu TanakaMitsumasa Koyanagi
Published in: 3DIC (2016)
Keyphrases
  • cost effective
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  • integrity constraints
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  • case study
  • machine learning
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