Makoto Motoyoshi

Publication Activity (10 Years)

Years Active: 2009-2023
Publications (10 Years): 6

Top Topics

Rapid Development

Latent Semantic Indexing

Texas Instruments

Intensity Values

Top Venues

Publications

Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding. 3DIC (2023)
Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima
Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. 3DIC (2021)
Miho Yamada, Shun Ono, Yasuo Arai, Ikuo Kurachi, Toru Tsuboyama, Masayuki Ikebe, Makoto Motoyoshi
3D Integrated Pixel Sensor with Silicon-on-Insulator Technology for the International Linear Collider Experiment. 3DIC (2019)
Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Shunta Endo
Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction. 3DIC (2019)
Mariappan Murugesan, Jichel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi
Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology. 3DIC (2016)
Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Junichi Takanohashi, Mariappan Murugesan, Masahiro Aoyagi, Mitsumasa Koyanagi
3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions. 3DIC (2016)
Makoto Motoyoshi, Junichi Takanohashi, Takafumi Fukushima, Yasuo Arai, Mitsumasa Koyanagi
Stacked SOI pixel detector using versatile fine pitch μ-bump technology. 3DIC (2011)
Makoto Motoyoshi
Through-Silicon Via (TSV). Proc. IEEE 97 (1) (2009)