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3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions.

Makoto MotoyoshiKohki YanagimuraTaikoh FushimiJunichi TakanohashiMariappan MurugesanMasahiro AoyagiMitsumasa Koyanagi
Published in: 3DIC (2016)
Keyphrases
  • sensor technology
  • image sensor
  • real time
  • image processing
  • high quality
  • noisy images