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Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications.

Mariappan MurugesanE. SoneA. SimomuraMakoto MotoyoshiM. SawaK. FukudaMitsumasa KoyanagiTakafumi Fukushima
Published in: 3DIC (2021)
Keyphrases
  • electron microscopy
  • mechanical properties
  • neural network
  • machine learning
  • information retrieval
  • three dimensional
  • high level
  • latent semantic indexing