Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding.
Takafumi FukushimaTaku SuzukiHideto HashiguchiChisato NagaiJichoel BeaHiroyuki HashimotoMariappan MurugesanKang Wook LeeTetsu TanakaKazushi AsamiYasuhiro KitamuraMitsumasa KoyanagiPublished in: 3DIC (2015)
Keyphrases
- high precision
- high throughput
- high recall
- microarray
- proteomic data
- genome wide
- protein protein interactions
- biological data
- transfer learning
- systems biology
- genomic data
- high speed
- high accuracy
- mass spectrometry
- low cost
- mass spectrometry data
- dna sequencing
- ms ms
- integrated circuit
- low latency
- real time
- gene expression data
- data acquisition
- data sets