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Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding.

Takafumi FukushimaTaku SuzukiHideto HashiguchiChisato NagaiJichoel BeaHiroyuki HashimotoMariappan MurugesanKang Wook LeeTetsu TanakaKazushi AsamiYasuhiro KitamuraMitsumasa Koyanagi
Published in: 3DIC (2015)
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