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Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV.

Mariappan MurugesanJichoel BeaKang Wook LeeTakafumi FukushimaTetsu TanakaMitsumasa KoyanagiYuji SutouH. WangJ. Koike
Published in: 3DIC (2013)
Keyphrases
  • electron microscopy
  • multi layer
  • silicon dioxide
  • genetic algorithm
  • integrated circuit
  • application layer
  • diffusion processes
  • fuel cell