Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE.

Takafumi Fukushima

Published in: VLSI Circuits (2021)

Keyphrases

rapid development
high density
data processing
data structure
high speed
technological advances
computer vision
case study
st century
web intelligence
cost effective
digital media
web technologies
key technologies
personal computer
data mining
collaborative learning
multimedia
artificial intelligence