Development of via-last 3D integration technologies using a new temporary adhesive system.
Takafumi FukushimaJichoel BeaMariappan MurugesanKang Wook LeeMitsumasa KoyanagiPublished in: 3DIC (2013)
Keyphrases
- st century
- data mining
- pervasive computing
- design principles
- software engineering
- development efforts
- web technologies
- technical solutions
- technical issues
- information society
- expert systems
- knowledge based systems
- learning environment
- academic institutions
- case study
- agent based systems
- enabling technologies
- neural network
- design tools
- website
- development process
- data integration