Login / Signup
Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory.
Kang Wook Lee
Seiya Tanikawa
Mariappan Murugesan
H. Naganuma
Jichoel Bea
Takafumi Fukushima
Tetsu Tanaka
Mitsumasa Koyanagi
Published in:
3DIC (2013)
Keyphrases
</>
main memory
memory subsystem
memory usage
computing power
high density
long term
memory requirements
multi dimensional
low cost
limited memory
external memory
memory access
memory size
random access memory
neural network
embedded dram
dynamic random access memory