Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last.
Jiayi ShenChang LiuTadaaki HoshiAtsushi SinodaHisashi KinoTetsu TanakaMariappan MurugesanMitsumasa KoyanagiTakafumi FukushimaPublished in: 3DIC (2023)