High density Cu-TSVs and reliability issues.

Mariappan Murugesan Harufumi Kobayashi Takafumi Fukushima Tetsu Tanaka Mitsumasa Koyanagi

Published in: 3DIC (2011)

Keyphrases

field effect transistors
high density
low density
close proximity
high bandwidth
magnetic recording
key issues
high power
data center
thin film
highly reliable
three dimensional
reliability analysis
electron microscopy
x ray
database systems
magnetic tape
genetic algorithm