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Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system.
Hiroyuki Hashimoto
Takafumi Fukushima
Kang Wook Lee
Mitsumasa Koyanagi
Tetsu Tanaka
Published in:
3DIC (2013)
Keyphrases
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highly efficient
high end
low cost
multithreading
cell processor
computer systems
low complexity
parallel processing
real time
case study
search algorithm
data processing
gray code
low latency
gate array
backtrack search
memory management
graphics processing units
computing systems
user queries
computer vision