Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding.
Mitsumasa KoyanagiTakafumi FukushimaTetsu TanakaPublished in: CICC (2010)
Keyphrases
- three dimensional
- semiconductor manufacturing
- integrated circuit
- massively parallel
- solar cell
- rapid development
- data processing
- x ray
- virtual reality
- cost effective
- databases
- st century
- d objects
- chance discovery
- production system
- enterprise wide
- wafer fabrication
- parallel computing
- computer systems
- medical images
- data model
- case study