Tianming Ni

Publication Activity (10 Years)

Years Active: 2016-2024
Publications (10 Years): 83

Top Topics

Integrated Circuit

Top Venues

IEICE Electron. Express

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

Microelectron. J.

Publications

Zhengfeng Huang, Yan Zhang, Lei Ai, Huaguo Liang, Tianming Ni, Tai Song, Aibin Yan
Designs of High-Speed Triple-Node-Upset Hardened Latch Based on Dual-Modular-Redundancy. J. Circuits Syst. Comput. 33 (5) (2024)
Aibin Yan, Yu Chen, Zhongyu Gao, Tianming Ni, Zhengfeng Huang, Jie Cui, Patrick Girard, Xiaoqing Wen
FeMPIM: A FeFET-Based Multifunctional Processing-in-Memory Cell. IEEE Trans. Circuits Syst. II Express Briefs 71 (4) (2024)
Tianming Ni, Xiaoqing Wen, Hussam Amrouch, Cheng Zhuo, Peilin Song
Introduction to the Special Issue on Design for Testability and Reliability of Security-aware Hardware. ACM Trans. Design Autom. Electr. Syst. 29 (1) (2024)
Zhengfeng Huang, Zishuai Li, Liting Sun, Huaguo Liang, Tianming Ni, Aibin Yan
A Quadruple-Node Upsets Hardened Latch Design Based on Cross-Coupled Elements. J. Electron. Test. 40 (1) (2024)
Zhengfeng Huang, Jingchang Bian, Yankun Lin, Huaguo Liang, Tianming Ni
Design Guidelines and Feedback Structure of Ring Oscillator PUF for Performance Improvement. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43 (1) (2024)
Jingchang Bian, Zhengfeng Huang, Yankun Lin, Zhao Yang, Huaguo Liang, Tianming Ni
Reliability analysis and comparison of ring-PUF based on probabilistic models. Microelectron. J. 144 (2024)
Aibin Yan, Zhixing Li, Zhongyu Gao, Jing Zhang, Zhengfeng Huang, Tianming Ni, Jie Cui, Xiaolei Wang, Patrick Girard, Xiaoqing Wen
MURLAV: A Multiple-Node-Upset Recovery Latch and Algorithm-Based Verification Method. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43 (7) (2024)
Aibin Yan, Litao Wang, Jie Cui, Zhengfeng Huang, Tianming Ni, Patrick Girard, Xiaoqing Wen
Nonvolatile Latch Designs With Node-Upset Tolerance and Recovery Using Magnetic Tunnel Junctions and CMOS. IEEE Trans. Very Large Scale Integr. Syst. 32 (1) (2024)
Aibin Yan, Chen Dong, Xing Guo, Jie Song, Jie Cui, Tianming Ni, Patrick Girard, Xiaoqing Wen
IDLD: Interlocked Dual-Circle Latch Design with Low Cost and Triple-Node-Upset-Recovery for Aerospace Applications. ACM Great Lakes Symposium on VLSI (2024)
Zhengfeng Huang, Zhouyu Gong, Dongxing Ma, Xiaolei Wang, Yingchun Lu, Wenfa Zhan, Huaguo Liang, Tianming Ni
Fault-avoidance C-element based low overhead and TNU-resilient latch. Microelectron. J. 131 (2023)
Aibin Yan, Jing Xiang, Zhengfeng Huang, Tianming Ni, Jie Cui, Patrick Girard, Xiaoqing Wen
Design of A Highly Reliable and Low-Power SRAM With Double-Node Upset Recovery for Safety-critical Applications. ITC-Asia (2023)
Aibin Yan, Xuehua Li, Tianming Ni, Zhengfeng Huang, Xiaoqing Wen
A Robust and High-Performance Flip-Flop with Complete Soft-Error Recovery. DSA (2023)
Aibin Yan, Fan Xia, Tianming Ni, Jie Cui, Zhengfeng Huang, Patrick Girard, Xiaoqing Wen
A Low Overhead and Double-Node-Upset Self-Recoverable Latch. ITC-Asia (2023)
Aibin Yan, Shaojie Wei, Jinjun Zhang, Jie Cui, Jie Song, Tianming Ni, Patrick Girard, Xiaoqing Wen
A Low Area and Low Delay Latch Design with Complete Double-Node-Upset-Recovery for Aerospace Applications. ACM Great Lakes Symposium on VLSI (2023)
Zhengfeng Huang, Dongxing Ma, Runwu Ji, Huaguo Liang, Aibin Yan, Tai Song, Tianming Ni
Overhead Optimized and Quadruple-Node-Upset Self-Recoverable Latch Design Based on Looped C-Element Matrix. IEEE Trans. Aerosp. Electron. Syst. 59 (6) (2023)
Tianming Ni, Fei Li, Qingsong Peng, Senling Wang, Xiaoqing Wen
A Lightweight and Machine-Learning-Resistant PUF framework based on Nonlinear Structure and Obfuscating Challenges. AsianHOST (2023)
Aibin Yan, Yuting He, Xiaoxiao Niu, Jie Cui, Tianming Ni, Zhengfeng Huang, Patrick Girard, Xiaoqing Wen
A Highly Robust and Low-Power Flip-Flop Cell With Complete Double-Node-Upset Tolerance for Aerospace Applications. IEEE Des. Test 40 (4) (2023)
Zhengfeng Huang, Lanxi Duan, Yan Zhang, Tianming Ni, Aibin Yan
A Soft-Error-Immune Quadruple-Node-Upset Tolerant Latch. IEEE Trans. Aerosp. Electron. Syst. 59 (3) (2023)
Aibin Yan, Aoran Cao, Zhengfeng Huang, Jie Cui, Tianming Ni, Patrick Girard, Xiaoqing Wen, Jiliang Zhang
Two Double-Node-Upset-Hardened Flip-Flop Designs for High-Performance Applications. IEEE Trans. Emerg. Top. Comput. 11 (4) (2023)
Aibin Yan, Yang Chang, Jing Xiang, Hao Luo, Jie Cui, Zhengfeng Huang, Tianming Ni, Xiaoqing Wen
Two Highly Reliable and High-Speed SRAM Cells for Safety-Critical Applications. ACM Great Lakes Symposium on VLSI (2023)
Mu Nie, Wen Jiang, Wankou Yang, Senling Wang, Xiaoqing Wen, Tianming Ni
Enhancing Defect Diagnosis and Localization in Wafer Map Testing Through Weakly Supervised Learning. ATS (2023)
Aibin Yan, Zhixing Li, Jie Cui, Zhengfeng Huang, Tianming Ni, Patrick Girard, Xiaoqing Wen
Designs of Two Quadruple-Node-Upset Self-Recoverable Latches for Highly Robust Computing in Harsh Radiation Environments. IEEE Trans. Aerosp. Electron. Syst. 59 (3) (2023)
Aibin Yan, Runqi Liu, Jie Cui, Tianming Ni, Patrick Girard, Xiaoqing Wen, Jiliang Zhang
Designs of BCD Adder Based on Excess-3 Code in Quantum-Dot Cellular Automata. IEEE Trans. Circuits Syst. II Express Briefs 70 (6) (2023)
Aobo Li, Dongsheng Liu, Cong Zhang, Xiang Li, Shuo Yang, Xingjie Liu, Jiahao Lu, Xuecheng Zou, Ang Hu, Tianming Ni
A Flexible and High-Performance Lattice-Based Post-Quantum Crypto Secure Coprocessor. IEEE Trans. Ind. Informatics 19 (2) (2023)
Xiao Dong, Yufei Chen, Jun Chen, Yucheng Wang, Ji Li, Tianming Ni, Zhiguo Shi, Xunzhao Yin, Cheng Zhuo
Worst-case Power Integrity Prediction Using Convolutional Neural Network. ACM Trans. Design Autom. Electr. Syst. 28 (4) (2023)
Senling Wang, Shaoqi Wei, Jun Ma, Hiroshi Kai, Yoshinobu Higami, Hiroshi Takahashi, Akihiro Shimizu, Xiaoqing Wen, Tianming Ni
SASL-JTAG: A Light-Weight Dependable JTAG. DFT (2023)
Aibin Yan, Zhixing Li, Jie Cui, Zhengfeng Huang, Tianming Ni, Patrick Girard, Xiaoqing Wen
LDAVPM: A Latch Design and Algorithm-Based Verification Protected Against Multiple-Node-Upsets in Harsh Radiation Environments. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (6) (2023)
Aibin Yan, Xuehua Li, Zhongyu Gao, Zhengfeng Huang, Tianming Ni, Xiaoqing Wen
Advanced DICE Based Triple-Node-Upset Recovery Latch with Optimized Overhead for Space Applications. ATS (2023)
Tianming Ni, Qingsong Peng, Jingchang Bian, Liang Yao, Zhengfeng Huang, Aibin Yan, Senling Wang, Xiaoqing Wen
Design of True Random Number Generator Based on Multi-Ring Convergence Oscillator Using Short Pulse Enhanced Randomness. IEEE Trans. Circuits Syst. I Regul. Pap. 70 (12) (2023)
Aibin Yan, Zhen Zhou, Shaojie Wei, Jie Cui, Yong Zhou, Tianming Ni, Patrick Girard, Xiaoqing Wen
A Highly Robust, Low Delay and DNU-Recovery Latch Design for Nanoscale CMOS Technology. ACM Great Lakes Symposium on VLSI (2022)
Tianming Ni, Qingsong Peng, Jingchang Bian, Liang Yao, Zhengfeng Huang, Aibin Yan, Xiaoqing Wen
MRCO: A Multi-ring Convergence Oscillator-based High-Efficiency True Random Number Generator. AsianHOST (2022)
Kang Yang, Dan Wu, Wengen Gao, Tianming Ni, Qiannian Zhang, Hongwei Zhang, Dengchao Huang
Calibration of SQUID Magnetometers in Multichannel MCG System Based on Bi-Planar Coil. IEEE Trans. Instrum. Meas. 71 (2022)
Tianming Ni, Jingchang Bian, Zhao Yang, Mu Nie, Liang Yao, Zhengfeng Huang, Aibin Yan, Xiaoqing Wen
Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement. IEEE Des. Test 39 (5) (2022)
Aibin Yan, Kuikui Qian, Tai Song, Zhengfeng Huang, Tianming Ni, Yu Chen, Xiaoqing Wen
A double-node-upset completely tolerant CMOS latch design with extremely low cost for high-performance applications. Integr. 86 (2022)
Aibin Yan, Zhixing Li, Shiwei Huang, Zijie Zhai, Xiangyu Cheng, Jie Cui, Tianming Ni, Xiaoqing Wen, Patrick Girard
SCLCRL: Shuttling C-elements based Low-Cost and Robust Latch Design Protected against Triple Node Upsets in Harsh Radiation Environments. DATE (2022)
Aibin Yan, Shukai Song, Jixiang Zhang, Jie Cui, Zhengfeng Huang, Tianming Ni, Xiaoqing Wen, Patrick Girard
Cost-Optimized and Robust Latch Hardened against Quadruple Node Upsets for Nanoscale CMOS. ITC-Asia (2022)
Aibin Yan, Zhelong Xu, Xiangfeng Feng, Jie Cui, Zhili Chen, Tianming Ni, Zhengfeng Huang, Patrick Girard, Xiaoqing Wen
Novel Quadruple-Node-Upset-Tolerant Latch Designs With Optimized Overhead for Reliable Computing in Harsh Radiation Environments. IEEE Trans. Emerg. Top. Comput. 10 (1) (2022)
Qi Xu, Hao Geng, Tianming Ni, Song Chen, Bei Yu, Yi Kang, Xiaoqing Wen
Fortune: A New Fault-Tolerance TSV Configuration in Router-Based Redundancy Structure. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (10) (2022)
Liang Yao, Huaguo Liang, Hong Zhang, Tianming Ni, Maoxiang Yi, Yingchun Lu
A Lightweight M_TRNG Design based on MUX Cell Entropy using Multiphase Sampling. AsianHOST (2022)
Jianguo Cui, Maoxiang Yi, Di Cao, Liang Yao, Xinyu Wang, Huaguo Liang, Zhengfeng Huang, Haochen Qi, Tianming Ni, Yingchun Lu
Design of True Random Number Generator Based on Multi-Stage Feedback Ring Oscillator. IEEE Trans. Circuits Syst. II Express Briefs 69 (3) (2022)
Tai Song, Tianming Ni, Zhengfeng Huang, Jinlei Wan
Valid test pattern identification for VLSI adaptive test. Integr. 82 (2022)
Aibin Yan, Zhihui He, Jun Zhou, Jie Cui, Tianming Ni, Zhengfeng Huang, Xiaoqing Wen, Patrick Girard
Dual-modular-redundancy and dual-level error-interception based triple-node-upset tolerant latch designs for safety-critical applications. Microelectron. J. 111 (2021)
Tianming Ni, Zhao Yang, Hao Chang, Xiaoqiang Zhang, Lin Lu, Aibin Yan, Zhengfeng Huang, Xiaoqing Wen
A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using Honeycomb Topology. IEEE Trans. Emerg. Top. Comput. 9 (2) (2021)
Aibin Yan, Zijie Zhai, Lele Wang, Jixiang Zhang, Ningning Cui, Tianming Ni, Xiaoqing Wen
Parallel DICE Cells and Dual-Level CEs based 3-Node-Upset Tolerant Latch Design for Highly Robust Computing. ITC-Asia (2021)
Chang Hao, Zhengfeng Huang, Tianming Ni
Kelvin Bridge Structure Based TSV Test for Weak Faults. ITC-Asia (2021)
Zhengfeng Huang, Xiandong Li, Zhouyu Gong, Huaguo Liang, Yingchun Lu, Yiming Ouyang, Tianming Ni
Design of MNU-Resilient latches based on input-split C-elements. Microelectron. J. 116 (2021)
Aibin Yan, Aoran Cao, Zhelong Xu, Jie Cui, Tianming Ni, Patrick Girard, Xiaoqing Wen
Design of Radiation Hardened Latch and Flip-Flop with Cost-Effectiveness for Low-Orbit Aerospace Applications. J. Electron. Test. 37 (4) (2021)
Aibin Yan, Kuikui Qian, Jie Cui, Ningning Cui, Tianming Ni, Zhengfeng Huang, Xiaoqing Wen
A Sextuple Cross-Coupled Dual-Interlocked-Storage-Cell based Multiple-Node-Upset Self-Recoverable Latch. NANOARCH (2021)
Zhengfeng Huang, Shangjie Pan, Hao Wang, Huaguo Liang, Tianming Ni
LC-TSL: A low-cost triple-node-upset self-recovery latch design based on heterogeneous elements for 22 nm CMOS. Microelectron. J. 117 (2021)
Zhengfeng Huang, Hao Wang, Yang Ang, Huaguo Liang, Yiming Ouyang, Tianming Ni
A high-speed and triple-node-upset recovery latch with heterogeneous interconnection. Microelectron. J. 118 (2021)
Chang Hao, Xu Yong, Tianming Ni
A Test Method for Large-size TSV Considering Resistive Open Fault and Leakage Fault Coexistence. VLSI-DAT (2021)
Huaguo Liang, Danqing Li, Zhao Yang, Tianming Ni, Zhengfeng Huang, Cuiyun Jiang
A N: 1 Single-Channel TDMA Fault-Tolerant Technique for TSVs in 3D-ICs. ITC-Asia (2021)
Zhengfeng Huang, Zian Su, Tianming Ni, Qi Xu, Haochen Qi, Yingchun Lu, Manzi Eric, Hui Xu
Cross-Layer Dual Modular Redundancy Hardened Scheme of Flip-Flop Design Based on Sense-Amplifier. J. Circuits Syst. Comput. 30 (5) (2021)
Liang Qi, Tianming Ni, Xinyu Qin, Mingyi Chen, Yongfu Li, Guoxing Wang
Continuous-time Delta-Sigma Modulators: Single-loop versus MASH. ISOCC (2021)
Zhengfeng Huang, Di Cao, Jianguo Cui, Yingchun Lu, Huaguo Liang, Yiming Ouyang, Tianming Ni, Zhenmin Li
Design of node separated triple-node-upset self-recoverable latch. Microelectron. J. 114 (2021)
Aibin Yan, Aoran Cao, Zhengzheng Fan, Zhelong Xu, Tianming Ni, Patrick Girard, Xiaoqing Wen
A 4NU-Recoverable and HIS-Insensitive Latch Design for Highly Robust Computing in Harsh Radiation Environments. ACM Great Lakes Symposium on VLSI (2021)
Tai Song, Huaguo Liang, Zhengfeng Huang, Tianming Ni, Ying Sun
Chip test pattern reordering method using adaptive test to reduce cost for testing of ICs. IEICE Electron. Express 18 (2) (2021)
Tianming Ni, Qi Xu, Zhengfeng Huang, Huaguo Liang, Aibin Yan, Xiaoqing Wen
A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40 (9) (2021)
Zhengfeng Huang, Xiandong Li, Shangjie Pan, Min Wang, Tianming Ni
A SEU Immune Flip-Flop with Low Overhead. ML4CS (2) (2020)
Tianming Ni, Yao Yao, Hao Chang, Lin Lu, Huaguo Liang, Aibin Yan, Zhengfeng Huang, Xiaoqing Wen
LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39 (10) (2020)
Aibin Yan, Yan Chen, Jun Zhou, Jie Cui, Tianming Ni, Xiaoqing Wen, Patrick Girard
A Sextuple Cross-Coupled SRAM Cell Protected against Double-Node Upsets. ATS (2020)
Tianming Ni, Dongsheng Liu, Qi Xu, Zhengfeng Huang, Huaguo Liang, Aibin Yan
Architecture of Cobweb-Based Redundant TSV for Clustered Faults. IEEE Trans. Very Large Scale Integr. Syst. 28 (7) (2020)
Zhengda Dou, Aibin Yan, Jun Zhou, Yuanjie Hu, Yan Chen, Tianming Ni, Jie Cui, Patrick Girard, Xiaoqing Wen
Design of a Highly Reliable SRAM Cell with Advanced Self-Recoverability from Soft Errors. ITC-Asia (2020)
Aibin Yan, Yuanjie Hu, Jie Cui, Zhili Chen, Zhengfeng Huang, Tianming Ni, Patrick Girard, Xiaoqing Wen
Information Assurance Through Redundant Design: A Novel TNU Error-Resilient Latch for Harsh Radiation Environment. IEEE Trans. Computers 69 (6) (2020)
Tianming Ni, Yue Shu, Hao Chang, Lin Lu, Guangzhen Dai, Shidong Zhu, Chengming Qu, Zhengfeng Huang
CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs. J. Circuits Syst. Comput. 29 (11) (2020)
Aibin Yan, Yan Chen, Yuanjie Hu, Jun Zhou, Tianming Ni, Jie Cui, Patrick Girard, Xiaoqing Wen
Novel Speed-and-Power-Optimized SRAM Cell Designs With Enhanced Self-Recoverability From Single- and Double-Node Upsets. IEEE Trans. Circuits Syst. (12) (2020)
Xiaoqiang Zhang, Xinggan Zhang, Lan Tang, Xinxing Zheng, Tianming Ni, Ning Wu
A low critical path delay structure for composite field AES S-box based on constant matrices multiplication merging. IEICE Electron. Express 17 (7) (2020)
Tai Song, Huaguo Liang, Tianming Ni, Zhengfeng Huang, Yingchun Lu, Jinlei Wan, Aibin Yan
Pattern Reorder for Test Cost Reduction Through Improved SVMRANK Algorithm. IEEE Access 8 (2020)
Tianming Ni, Hao Chang, Tai Song, Qi Xu, Zhengfeng Huang, Huaguo Liang, Aibin Yan, Xiaoqing Wen
Non-Intrusive Online Distributed Pulse Shrinking-Based Interconnect Testing in 2.5D IC. IEEE Trans. Circuits Syst. (11) (2020)
Tianming Ni, Hao Chang, Shidong Zhu, Lin Lu, Xueyun Li, Qi Xu, Huaguo Liang, Zhengfeng Huang
Temperature-Aware Floorplanning for Fixed-Outline 3D ICs. IEEE Access 7 (2019)
Aibin Yan, Jun Zhou, Yuanjie Hu, Yan Chen, Zhen Wu, Tianming Ni
Design of a Novel Self-Recoverable SRAM Cell Protected Against Soft Errors. DSA (2019)
Maoxiang Yi, Jingchang Bian, Tianming Ni, Cuiyun Jiang, Hao Chang, Huaguo Liang
A Pulse Shrinking-Based Test Solution for Prebond Through Silicon via in 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38 (4) (2019)
Tianming Ni, Hao Chang, Yao Yao, Xueyun Li, Zhengfeng Huang
A Novel Built-In Self-Repair Scheme for 3D Memory. IEEE Access 7 (2019)
Tianming Ni, Hao Chang, Xian Sun, Xia Xiuzhen, Zhengfeng Huang
An enhanced time-to-digital conversion solution for pre-bond TSV dual faults testing. IEICE Electron. Express 16 (3) (2019)
Tianming Ni, Hao Chang, Haochen Qi, Zhengfeng Huang
A novel in-field TSV repair method for latent faults. IEICE Electron. Express 15 (23) (2018)
Xiumin Xu, Huaguo Liang, Kai Zhou, Gaoliang Ma, Zhengfeng Huang, Maoxiang Yi, Tianming Ni, Yingchun Lu
An All-Digital and Jitter-Quantizing True Random Number Generator in SRAM-Based FPGAs. ATS (2018)
Zhengfeng Huang, Yangyang Zhang, Zian Su, Huaguo Liang, Huijie Yao, Tianming Ni
A Hybrid DMR Latch to Tolerate MNU Using TDICE and WDICE. ATS (2018)
Tianming Ni, Hao Chang, Xiaoqiang Zhang, Hao Xiao, Zhengfeng Huang
Research on physical unclonable functions circuit based on three dimensional integrated circuit. IEICE Electron. Express 15 (23) (2018)
Tianming Ni, Mu Nie, Huaguo Liang, Jingchang Bian, Xiumin Xu, Xiangsheng Fang, Zhengfeng Huang, Xiaoqing Wen
Vernier ring based pre-bond through silicon vias test in 3D ICs. IEICE Electron. Express 14 (18) (2017)
Xiumin Xu, Huaguo Liang, Zhengfeng Huang, Cuiyun Jiang, Yingchun Lu, Aibin Yan, Tianming Ni, Maoxiang Yi
A single event transient detector in SRAM-based FPGAs. IEICE Electron. Express 14 (12) (2017)
Tianming Ni, Huaguo Liang, Mu Nie, Xiumin Xu, Aibin Yan, Zhengfeng Huang
A Region-Based Through-Silicon via Repair Method for Clustered Faults. IEICE Trans. Electron. (12) (2017)
Xiumin Xu, Huaguo Liang, Zhengfeng Huang, Cuiyun Jiang, Yiming Ouyang, Xiangsheng Fang, Tianming Ni, Maoxiang Yi
A highly reliable butterfly PUF in SRAM-based FPGAs. IEICE Electron. Express 14 (14) (2017)
Maoxiang Yi, Xiaohong Liu, Qingwu Wu, Tianming Ni, Zhengfeng Huang, Huaguo Liang
NBTI mitigation by M-IVC with input duty cycle and randomness constraints. EWDTS (2016)