Jingchang Bian

Publication Activity (10 Years)

Years Active: 2017-2024
Publications (10 Years): 9

Top Topics

Fingerprint Authentication

Probabilistic Model

Top Venues

ACM Trans. Design Autom. Electr. Syst.

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

IEEE Trans. Circuits Syst. I Regul. Pap.

Publications

Zhengfeng Huang, Jingchang Bian, Yankun Lin, Huaguo Liang, Tianming Ni
Design Guidelines and Feedback Structure of Ring Oscillator PUF for Performance Improvement. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43 (1) (2024)
Jingchang Bian, Zhengfeng Huang, Yankun Lin, Zhao Yang, Huaguo Liang, Tianming Ni
Reliability analysis and comparison of ring-PUF based on probabilistic models. Microelectron. J. 144 (2024)
Qingsong Peng, Jingchang Bian, Zhengfeng Huang, Senling Wang, Aibin Yan
A Compact TRNG Design for FPGA Based on the Metastability of RO-driven Shift Registers. ACM Trans. Design Autom. Electr. Syst. 29 (1) (2024)
Jingchang Bian, Zhengfeng Huang, Peng Ye, Zhao Yang, Huaguo Liang
A Reliability-Aware Splitting Duty-Cycle Physical Unclonable Function Based on Trade-off Process, Voltage, and Temperature Variations. ACM Trans. Design Autom. Electr. Syst. 29 (1) (2024)
Tianming Ni, Qingsong Peng, Jingchang Bian, Liang Yao, Zhengfeng Huang, Aibin Yan, Senling Wang, Xiaoqing Wen
Design of True Random Number Generator Based on Multi-Ring Convergence Oscillator Using Short Pulse Enhanced Randomness. IEEE Trans. Circuits Syst. I Regul. Pap. 70 (12) (2023)
Tianming Ni, Qingsong Peng, Jingchang Bian, Liang Yao, Zhengfeng Huang, Aibin Yan, Xiaoqing Wen
MRCO: A Multi-ring Convergence Oscillator-based High-Efficiency True Random Number Generator. AsianHOST (2022)
Tianming Ni, Jingchang Bian, Zhao Yang, Mu Nie, Liang Yao, Zhengfeng Huang, Aibin Yan, Xiaoqing Wen
Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement. IEEE Des. Test 39 (5) (2022)
Maoxiang Yi, Jingchang Bian, Tianming Ni, Cuiyun Jiang, Hao Chang, Huaguo Liang
A Pulse Shrinking-Based Test Solution for Prebond Through Silicon via in 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38 (4) (2019)
Tianming Ni, Mu Nie, Huaguo Liang, Jingchang Bian, Xiumin Xu, Xiangsheng Fang, Zhengfeng Huang, Xiaoqing Wen
Vernier ring based pre-bond through silicon vias test in 3D ICs. IEICE Electron. Express 14 (18) (2017)