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A Pulse Shrinking-Based Test Solution for Prebond Through Silicon via in 3-D ICs.
Maoxiang Yi
Jingchang Bian
Tianming Ni
Cuiyun Jiang
Hao Chang
Huaguo Liang
Published in:
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2019)
Keyphrases
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real time
multiscale
optimal solution
solution quality
database
neural network
data mining
genetic algorithm
multi agent
np hard
closed form
high density
linear equations