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Mu Nie
Publication Activity (10 Years)
Years Active: 2017-2023
Publications (10 Years): 8
Top Topics
Human Pose
Spatio Temporal
Space Time
Action Recognition
Top Venues
CoRR
IEEE Des. Test
ATS
Eng. Appl. Artif. Intell.
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Publications
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Mu Nie
,
Sen Yang
,
Zhenhua Wang
,
Baochang Zhang
,
Huimin Lu
,
Wankou Yang
Multi-receptive field spatiotemporal network for action recognition.
Int. J. Mach. Learn. Cybern.
14 (7) (2023)
Mu Nie
,
Zhibin Quan
,
Weiping Ding
,
Wankou Yang
Enhancing motion visual cues for self-supervised video representation learning.
Eng. Appl. Artif. Intell.
123 (Part A) (2023)
Mu Nie
,
Wen Jiang
,
Wankou Yang
,
Senling Wang
,
Xiaoqing Wen
,
Tianming Ni
Enhancing Defect Diagnosis and Localization in Wafer Map Testing Through Weakly Supervised Learning.
ATS
(2023)
Tianming Ni
,
Jingchang Bian
,
Zhao Yang
,
Mu Nie
,
Liang Yao
,
Zhengfeng Huang
,
Aibin Yan
,
Xiaoqing Wen
Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement.
IEEE Des. Test
39 (5) (2022)
Sen Yang
,
Zhibin Quan
,
Mu Nie
,
Wankou Yang
TransPose: Keypoint Localization via Transformer.
ICCV
(2021)
Sen Yang
,
Zhibin Quan
,
Mu Nie
,
Wankou Yang
TransPose: Towards Explainable Human Pose Estimation by Transformer.
CoRR
(2020)
Tianming Ni
,
Mu Nie
,
Huaguo Liang
,
Jingchang Bian
,
Xiumin Xu
,
Xiangsheng Fang
,
Zhengfeng Huang
,
Xiaoqing Wen
Vernier ring based pre-bond through silicon vias test in 3D ICs.
IEICE Electron. Express
14 (18) (2017)
Tianming Ni
,
Huaguo Liang
,
Mu Nie
,
Xiumin Xu
,
Aibin Yan
,
Zhengfeng Huang
A Region-Based Through-Silicon via Repair Method for Clustered Faults.
IEICE Trans. Electron.
(12) (2017)