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A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using Honeycomb Topology.

Tianming NiZhao YangHao ChangXiaoqiang ZhangLin LuAibin YanZhengfeng HuangXiaoqing Wen
Published in: IEEE Trans. Emerg. Top. Comput. (2021)
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