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A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC.
Tianming Ni
Qi Xu
Zhengfeng Huang
Huaguo Liang
Aibin Yan
Xiaoqing Wen
Published in:
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2021)
Keyphrases
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cost effective
low cost
cost effectiveness
integrated circuit
management system
data center
fault diagnosis
real time
software architecture
fault detection
fault isolation
repair actions
database systems
computational intelligence
information and communication technologies