Sign in

Cross-Layer Dual Modular Redundancy Hardened Scheme of Flip-Flop Design Based on Sense-Amplifier.

Zhengfeng HuangZian SuTianming NiQi XuHaochen QiYingchun LuManzi EricHui Xu
Published in: J. Circuits Syst. Comput. (2021)
Keyphrases
  • cross layer
  • user interface
  • design process
  • multimedia services
  • web services
  • signal processing
  • wireless networks
  • flip flops