Sungho Kang

ORCID

Publication Activity (10 Years)

Years Active: 1981-2023
Publications (10 Years): 128

Top Venues

ISOCC

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

IEEE Trans. Very Large Scale Integr. Syst.

IEEE Access

Publications

Hyunkyu Park, Sungho Kang, YeongHyeon Park, Yeonho Lee, Hanbyul Lee, Seho Bae, Juneho Yi
Unsupervised Image-to-Image Translation Based on Bidirectional Style Transfer. ICKII (2023)
Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang
GPU-Based Redundancy Analysis using Partitioning Method for Memory Repair. ISOCC (2023)
Yong Lee, Seokjun Jang, Sungho Kang
Shift Left Quality Management System (QMS) Using a 3-D Matrix Scanning Method on System on a Chip. IEEE Trans. Circuits Syst. II Express Briefs 70 (4) (2023)
Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
Redundancy Analysis Simplification Scheme for High-Speed Memory Repair. ISOCC (2023)
Youngkwang Lee, Donghyun Han, Sungho Kang
TSV Built-In Self-Repair Architecture for Improving the Yield and Reliability of HBM. IEEE Trans. Very Large Scale Integr. Syst. 31 (4) (2023)
Sungho Kang, Hyunkyu Park, YeongHyeon Park, Yeonho Lee, Hanbyul Lee, Seho Bae, Juneho Yi
Exploiting Monocular Depth Estimation for Style Harmonization in Landscape Painting. ICKII (2023)
Hayoung Lee, Jihye Kim, Jongho Park, Sungho Kang
STRAIT: Self-Test and Self-Recovery for AI Accelerator. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (9) (2023)
YeongHyeon Park, Sungho Kang, Myung Jin Kim, Yeonho Lee, Juneho Yi
Excision and Recovery: Enhancing Surface Anomaly Detection with Attention-based Single Deterministic Masking. CoRR (2023)
Hyojoon Yun, Tae-Hyun Kim, Sungho Kang
Machine Learning based Scan Chain Diagnosis for Double Faults. ISOCC (2023)
Sunghoon Kim, Donghyun Han, Seokjun Jang, Sungho Kang
LOTS: Low Overhead TSV Repair Method Using IEEE-1838 Standard Architecture. ISOCC (2023)
Hayoung Lee, Seung Ho Shin, Younwoo Yoo, Sungho Kang
TRUST: Through-Silicon via Repair Using Switch Matrix Topology. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (7) (2023)
Sunghoon Kim, Seokjun Jang, Sungho Kang
Scan Chain Architecture With Data Duplication for Multiple Scan Cell Fault Diagnosis. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (8) (2023)
Hyemin Kim, Sangjun Lee, Jongho Park, Sungwhan Park, Sungho Kang
A New Flip-flop Shared Architecture of Test Point Insertion for Scan Design. ISOCC (2023)
YeongHyeon Park, Sungho Kang, Myung Jin Kim, Hyeonho Jeong, Hyunkyu Park, Hyeong-Seok Kim, Juneho Yi
Neural Network Training Strategy to Enhance Anomaly Detection Performance: A Perspective on Reconstruction Loss Amplification. CoRR (2023)
Youngkwang Lee, Donghyun Han, Sooryeong Lee, Sungho Kang
Novel Error-Tolerant Voltage-Divider-Based Through-Silicon-Via Test Architecture. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (1) (2023)
Youngkwang Lee, Young-Woo Lee, Sungyoul Seo, Sungho Kang
Reduced-Pin-Count BOST for Test-Cost Reduction. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (3) (2022)
Hyeonchan Lim, Hyojoon Yun, Juyong Lee, Sungho Kang
Cell-Aware Scan Diagnosis Using Partially Synchronous Set and Reset. ISOCC (2022)
Seung Ho Shin, Hayoung Lee, Sooryeong Lee, Younwoo Yoo, Sungho Kang
An Improved Early Termination Methodology Using Convolutional Neural Network. ISOCC (2022)
Hogyeong Kim, Hayoung Lee, Donghyun Han, Sungho Kang
Multibank Optimized Redundancy Analysis Using Efficient Fault Collection. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (8) (2022)
Hyeonchan Lim, Hyojoon Yun, Sungho Kang
Scan Cell Modification for Intra Cell-Aware Scan Chain Diagnosis. IEEE Trans. Circuits Syst. II Express Briefs 69 (11) (2022)
Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
ECMO: ECC Architecture Reusing Content-Addressable Memories for Obtaining High Reliability in DRAM. IEEE Trans. Very Large Scale Integr. Syst. 30 (6) (2022)
Hyeonchan Lim, Hyojoon Yun, Sungho Kang
A Hybrid Test Scheme for Automotive IC in Multisite Testing. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (12) (2022)
Sunghoon Kim, Seokjun Jang, Youngki Moon, Sungho Kang
Pair-Grouping Scan Chain Architecture for Multiple Scan Cell Fault Diagnosis. ISOCC (2022)
Sangmin Park, Minho Cheong, Donghyun Han, Sungho Kang
Herringbone-Based TSV Architecture for Clustered Fault Repair and Aging Recovery. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (4) (2022)
Gyungbin Kim, Minho Cheong, Sungho Kang
SPAR: A New Test-Point Insertion Using Shared Points for Area Overhead Reduction. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (11) (2022)
Sooryeong Lee, Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
PROG: Per-Row Output Generator for BOST. ISOCC (2022)
Tae Hyun Kim, Hyeonchan Lim, Minho Cheong, Hyojoon Yun, Sungho Kang
Logic Diagnosis Based on Deep Learning for Multiple Faults. ISOCC (2022)
Hayoung Lee, Sooryeong Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
FAME: Fault Address Memory Structure for Repair Time Reduction. ISOCC (2022)
Jongho Park, Sangjun Lee, Inhwan Lee, Sungwhan Park, Sungho Kang
Correlation Aware Random Pattern Generation for Test Time and Shift Power Reduction of Logic BIST. ISOCC (2022)
Hyungil Woo, Seokjun Jang, Sungho Kang
A Secure Scan Architecture Protecting Scan Test and Scan Dump Using Skew-Based Lock and Key. IEEE Access 9 (2021)
Hayoung Lee, Hyunggoy Oh, Sungho Kang
On-Chip Error Detection Reusing Built-In Self-Repair for Silicon Debug. IEEE Access 9 (2021)
Sangjun Lee, Jongho Park, Inhwan Lee, Kwonhyoung Lee, Sungho Kang
Hybrid Test Access Mechanism for Multiple Identical Cores. ISOCC (2021)
Youngkwang Lee, Donghyun Han, Sooryeong Lee, Sungho Kang
A Circular-based TSV Repair Architecture. ISOCC (2021)
Donghyun Han, Hayoung Lee, Sungho Kang
Effective Spare Line Allocation Built-in Redundancy Analysis With Base Common Spare for Yield Improvement of 3D Memory. IEEE Access 9 (2021)
Donghyun Han, Youngkwang Lee, Sooryeong Lee, Sungho Kang
Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC. ISOCC (2021)
Seokjun Jang, Jihye Kim, Sungho Kang
Reconfigurable Scan Architecture for High Diagnostic Resolution. IEEE Access 9 (2021)
Sangjun Lee, Kyunghwan Cho, Jihye Kim, Jongho Park, Inhwan Lee, Sungho Kang
Low-Power Scan Correlation-Aware Scan Cluster Reordering for Wireless Sensor Networks. Sensors 21 (18) (2021)
Youngki Moon, Hyunho Yoo, Donghyun Han, Sungho Kang
Area Efficient Built-In Redundancy Analysis using Pre-Solutions with Various Spare Structure. ISOCC (2021)
Kwonhyoung Lee, Sangjun Lee, Jongho Park, Inhwan Lee, Sungho Kang
A Low-Power BIST Scheme Using Weight-Aware Scan Grouping and Scheduling for Automotive ICs. IEEE Access 9 (2021)
Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang
Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory. ISOCC (2021)
Donghyun Han, Hayoung Lee, Seungtaek Lee, Sungho Kang
ECC-Aware Fast and Reliable Pattern Matching Redundancy Analysis for Highly Reliable Memory. IEEE Access 9 (2021)
Seokjun Jang, Hyungil Woo, Sunghoon Kim, Sungho Kang
Secure Scan Design through Pseudo Fault Injection. ISOCC (2021)
Antea Risso, Vageeswar Rajaram, Matilde Maria Pavese, Sungho Kang, Sila Deniz Calisgan, Zhenyun Qian, Matteo Rinaldi
Long-lasting Leaf Water Stress Detector Based On An Infrared Micromechanical Photoswitch And A Solar Powered Sunlight Digitizer. IEEE SENSORS (2021)
Jungil Mok, Hyeonchan Lim, Sungho Kang
Enhanced Postbond Test Architecture for Bridge Defects Between the TSVs. IEEE Trans. Very Large Scale Integr. Syst. 29 (6) (2021)
Jaewon Park, Jae Hoon Lee, Sang-Kil Park, Ki Chul Chun, Kyomin Sohn, Sungho Kang
An In-DRAM BIST for 16 Gb DDR4 DRAM in the 2nd 10-nm-Class DRAM Process. IEEE Access 9 (2021)
Seung Ho Shin, Hayoung Lee, Younwoo Yoo, Sungho Kang
An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA. ISOCC (2021)
Tae Hyun Kim, Hayoung Lee, Sungho Kang
GPU-Based Redundancy Analysis Using Concurrent Evaluation. IEEE Trans. Very Large Scale Integr. Syst. 28 (3) (2020)
Minho Cheong, Ingeol Lee, Sungho Kang
A 3-D Rotation-Based Through-Silicon via Redundancy Architecture for Clustering Faults. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39 (9) (2020)
Hayoung Lee, Keewon Cho, Sungho Kang, Wooheon Kang, Seungtaek Lee, Woosik Jeong
Fail Memory Configuration Set for RA Estimation. ITC (2020)
Jihye Kim, Hayoung Lee, Seokjun Jang, Sungho Kang
Fine-Grained Defect Diagnosis for CMOL FPGA Circuits. IEEE Access 8 (2020)
Hayoung Lee, Donghyun Han, Hogyeong Kim, Sungho Kang
W-ERA: One-Time Memory Repair with Wafer-Level Early Repair Analysis for Cost Reduction. ITC-Asia (2020)
Jihye Kim, Hayoung Lee, Seokjun Jang, Hogyeong Kim, Sungho Kang
Memory-like Defect Diagnosis for CMOL FPGAs. ISOCC (2020)
Hyunyul Lim, Minho Cheong, Sungho Kang
Scan-Chain-Fault Diagnosis Using Regressions in Cryptographic Chips for Wireless Sensor Networks. Sensors 20 (17) (2020)
Hayoung Lee, Donghyun Han, Hogyeong Kim, Sungho Kang
Redundancy Analysis Optimization with Clustered Known Solutions for High Speed Repair. ISOCC (2020)
Sung-Wook Shin, Jung-Hyun Park, Woo-Jin Lee, Sungho Kang, Hyunggun Kim, Sung-Taek Chung
Analysis of Electroencephalography Signals on the Contents of Cognitive Function Game: Attention and Memory. J. Medical Imaging Health Informatics 10 (6) (2020)
Sangjun Lee, Kyunghwan Cho, Sungki Choi, Sungho Kang
A New Logic Topology-Based Scan Chain Stitching for Test-Power Reduction. IEEE Trans. Circuits Syst. (12) (2020)
Young-Woo Lee, Hyeonchan Lim, Youngkwang Lee, Sungho Kang
Robust Secure Shield Architecture for Detection and Protection Against Invasive Attacks. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39 (10) (2020)
Hyeonchan Lim, Tae Hyun Kim, Seunghwan Kim, Sungho Kang
Diagnosis of Scan Chain Faults Based-on Machine-Learning. ISOCC (2020)
Minho Cheng, Hyunyul Lim, Tae Hyun Kim, Sungho Kang
A Hardware-efficient TSV Repair Scheme Based on Butterfly Topology. ISOCC (2019)
Ingeol Lee, Minho Cheong, Sungho Kang
Highly Reliable Redundant TSV Architecture for Clustered Faults. IEEE Trans. Reliab. 68 (1) (2019)
Kyunghwan Cho, Jihye Kim, Hyunggoy Oh, Sangjun Lee, Sungho Kang
A New Scan Chain Reordering Method for Low Power Consumption based on Care Bit Density. ISOCC (2019)
Jihye Kim, Sangjun Lee, Sungho Kang
Test-Friendly Data-Selectable Self-Gating (DSSG). IEEE Trans. Very Large Scale Integr. Syst. 27 (8) (2019)
Young-Woo Lee, Youngkwang Lee, Minho Moon, Sungho Kang
Tunable Compact Probing Detector with Fast Analysis Time Against Invasive Attacks. ISOCC (2019)
Jihye Kim, Sangjun Lee, Minho Moon, Sungho Kang
Transition-delay Test Methodology for Designs with Self-gating. ISOCC (2019)
Hayoung Lee, Donghyun Han, Seungtaek Lee, Sungho Kang
Dynamic Built-In Redundancy Analysis for Memory Repair. IEEE Trans. Very Large Scale Integr. Syst. 27 (10) (2019)
Jaewon Jang, Minho Cheong, Sungho Kang
TSV Repair Architecture for Clustered Faults. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38 (1) (2019)
Sila Deniz Calisgan, Vageeswar Rajaram, Zhenyun Qian, Sungho Kang, Antea Risso, Matteo Rinaldi
Zero-Power Chemical Sensor Based on a Polymer/Metal Micromechanical Switch. IEEE SENSORS (2019)
Hayoung Lee, Donghyun Han, Seungtaek Lee, Sungho Kang
Redundancy Analysis based on Fault Distribution for Memory with Complex Spares. ISOCC (2019)
Keewon Cho, Young-Woo Lee, Sungyoul Seo, Sungho Kang
An Efficient BIRA Utilizing Characteristics of Spare Pivot Faults. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38 (3) (2019)
Keewon Cho, Young-Woo Lee, Sungyoul Seo, Sungho Kang
2-D Failure Bitmap Compression Using Line Fault Marking Method. ISOCC (2018)
Dongsu Lee, Hyunyul Lim, Tae Hyun Kim, Sungho Kang
Neural Network Reliability Enhancement Approach Using Dropout Underutilization in GPU. TENCON (2018)
Hayoung Lee, Jooyoung Kim, Keewon Cho, Sungho Kang
Fast Built-In Redundancy Analysis Based on Sequential Spare Line Allocation. IEEE Trans. Reliab. 67 (1) (2018)
Heetae Kim, Hyunggoy Oh, Sangjun Lee, Sungho Kang
Low Power Scan Chain Architecture Based on Circuit Topology. ISOCC (2018)
Hyunggoy Oh, Heetae Kim, Sangjun Lee, Sungho Kang
Dynamic voltage Drop induced Path Delay Analysis for STV and NTV Circuits during At-speed Scan Test. ISOCC (2018)
Minho Cheong, Ingeol Lee, Sungho Kang
A Test Methodology for Neural Computing Unit. ISOCC (2018)
Jaeil Lim, Hyunggoy Oh, Heetae Kim, Sungho Kang
Thermal Aware Test Scheduling for NTV Circuit. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37 (4) (2018)
Sila Deniz Calisgan, Vladimir Villanueva-Lopez, Vageeswar Rajaram, Zhenyun Qian, Sungho Kang, Samuel P. Hernandez-Rivera, Matteo Rinaldi
Spectroscopic Chemical Sensing Based on Narrowband MEMS Resonant Infrared Detectors. IEEE SENSORS (2018)
Sungyoul Seo, Keewon Cho, Young-Woo Lee, Sungho Kang
A Statistic-Based Scan Chain Reordering for Energy-Quality Scalable Scan Test. IEEE J. Emerg. Sel. Topics Circuits Syst. 8 (3) (2018)
Vageeswar Rajaram, Zhenyun Qian, Sungho Kang, Sila Deniz Calisgan, Nicol E. McGruer, Matteo Rinaldi
A False Alarm-Free Zero-Power Micromechanical Photoswitch. IEEE SENSORS (2018)
Hyeonchan Lim, Seokjun Jang, Sungho Kang
A Software-based Scan Chain Diagnosis for Double Faults in A Scan Chain. ISOCC (2018)
Hayoung Lee, Kiwon Cho, Donghyun Kim, Sungho Kang
Fault Group Pattern Matching With Efficient Early Termination for High-Speed Redundancy Analysis. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37 (7) (2018)
Donghyun Kim, Hayoung Lee, Sungho Kang
An Area-Efficient BIRA With 1-D Spare Segments. IEEE Trans. Very Large Scale Integr. Syst. 26 (1) (2018)
Inhyuk Choi, Hyunggoy Oh, Young-Woo Lee, Sungho Kang
Test Resource Reused Debug Scheme to Reduce the Post-Silicon Debug Cost. IEEE Trans. Computers 67 (12) (2018)
Donghyun Han, Hayoung Lee, Seungtaek Lee, Minho Moon, Sungho Kang
3D Memory Formed of Unrepairable Memory Dice and Spare Layer. TENCON (2018)
Hyunyul Lim, Tae Hyun Kim, Dongsu Lee, Sungho Kang
LARECD: Low area overhead and reliable error correction DMR architecture. ISOCC (2017)
Hyunggoy Oh, Inhyuk Choi, Sungho Kang
DRAM-Based Error Detection Method to Reduce the Post-Silicon Debug Time for Multiple Identical Cores. IEEE Trans. Computers 66 (9) (2017)
Jooyoung Kim, Woosung Lee, Keewon Cho, Sungho Kang
Hardware-Efficient Built-In Redundancy Analysis for Memory With Various Spares. IEEE Trans. Very Large Scale Integr. Syst. 25 (3) (2017)
Jaewon Jang, Minho Cheong, Jin-Ho Ahn, Sung Kyu Lim, Sungho Kang
Chain-Based Approach for Fast Through-Silicon-Via Coupling Delay Estimation. IEEE Trans. Very Large Scale Integr. Syst. 25 (3) (2017)
Hyeonchan Lim, Sungyoul Seo, Soyeon Kang, Sungho Kang
Broadcast scan compression based on deterministic pattern generation algorithm. ISQED (2017)
Donghyun Han, Hayoung Lee, Donghyun Kim, Sungho Kang
A new repair scheme for TSV-based 3D memory using base die repair cells. ISOCC (2017)
Keewon Cho, Young-Woo Lee, Sungyoul Seo, Sungho Kang
An efficient built-in self-repair scheme for area reduction. ISOCC (2017)
Hyunggoy Oh, Taewoo Han, Inhyuk Choi, Sungho Kang
An On-Chip Error Detection Method to Reduce the Post-Silicon Debug Time. IEEE Trans. Computers 66 (1) (2017)
Hyunggoy Oh, Heetae Kim, Jaeil Lim, Sungho Kang
A selective error data capture method using on-chip DRAM for silicon debug of multi-core design. ISOCC (2017)
Vageeswar Rajaram, Zhenyun Qian, Sungho Kang, Nicol E. McGruer, Matteo Rinaldi
Threshold scaling of near-zero power micromechanical photoswitches using bias voltage. IEEE SENSORS (2017)
Hyeonchan Lim, Junghwan Kim, Soyeon Kang, Sungho Kang
Test data reduction method based on berlekamp-massey algorithm. ISOCC (2017)
Young-Woo Lee, Hyeonchan Lim, Sungho Kang
Grouping-Based TSV Test Architecture for Resistive Open and Bridge Defects in 3-D-ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36 (10) (2017)
Hyunggoy Oh, Heetae Kim, Jaeil Lim, Sungho Kang
Reconfigurable scan architecture for test power and data volume reduction. IEICE Electron. Express 14 (13) (2017)
Jaeseok Park, Hyunyul Lim, Sungho Kang
FRESH: A New Test Result Extraction Scheme for Fast TSV Tests. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36 (2) (2017)
Younsun Kim, Hyunggoy Oh, Sungho Kang
Proof of Concept of Home IoT Connected Vehicles. Sensors 17 (6) (2017)
Sungyoul Seo, Hyeonchan Lim, Soyeon Kang, Sungho Kang
Off-chip test architecture for improving multi-site testing efficiency using tri-state decoder and 3V-level encoder. ISQED (2017)

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Publication Activity (10 Years)

Top Topics

Top Venues

Sungho Kang