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TRUST: Through-Silicon via Repair Using Switch Matrix Topology.
Hayoung Lee
Seung Ho Shin
Younwoo Yoo
Sungho Kang
Published in:
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2023)
Keyphrases
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high speed
trust model
low cost
singular value decomposition
high density
small world
data sets
database systems
multi agent systems
management system
covariance matrix
privacy concerns
topology preserving
trust management
matrix representation
transmission electron microscopy