Seung Ho Shin

Publication Activity (10 Years)

Years Active: 2021-2024
Publications (10 Years): 10

Top Topics

Convolutional Neural Network

Matrix Representation

Early Termination

Top Venues

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Seung Ho Shin, Hayoung Lee, Sungho Kang
GRAP: Efficient GPU-Based Redundancy Analysis Using Parallel Evaluation for Cross Faults. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43 (8) (2024)
Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang
GPU-Based Redundancy Analysis using Partitioning Method for Memory Repair. ISOCC (2023)
Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
Redundancy Analysis Simplification Scheme for High-Speed Memory Repair. ISOCC (2023)
Hayoung Lee, Seung Ho Shin, Younwoo Yoo, Sungho Kang
TRUST: Through-Silicon via Repair Using Switch Matrix Topology. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (7) (2023)
Seung Ho Shin, Hayoung Lee, Sooryeong Lee, Younwoo Yoo, Sungho Kang
An Improved Early Termination Methodology Using Convolutional Neural Network. ISOCC (2022)
Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
ECMO: ECC Architecture Reusing Content-Addressable Memories for Obtaining High Reliability in DRAM. IEEE Trans. Very Large Scale Integr. Syst. 30 (6) (2022)
Sooryeong Lee, Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
PROG: Per-Row Output Generator for BOST. ISOCC (2022)
Hayoung Lee, Sooryeong Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
FAME: Fault Address Memory Structure for Repair Time Reduction. ISOCC (2022)
Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang
Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory. ISOCC (2021)
Seung Ho Shin, Hayoung Lee, Younwoo Yoo, Sungho Kang
An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA. ISOCC (2021)