Sooryeong Lee

Publication Activity (10 Years)

Years Active: 2021-2024
Publications (10 Years): 9

Top Topics

Convolutional Neural Network

Silicon Dioxide

Early Termination

Top Venues

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

IEEE Trans. Circuits Syst. II Express Briefs

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Juyong Lee, Hayoung Lee, Sooryeong Lee, Sungho Kang
A New ISA for High-Speed and Area-Efficient ALPG. IEEE Trans. Circuits Syst. II Express Briefs 71 (7) (2024)
Hayoung Lee, Sooryeong Lee, Sungho Kang
A New Fail Address Memory Architecture for Cost-Effective ATE. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43 (4) (2024)
Hayoung Lee, Sooryeong Lee, Sungho Kang
RA-Aware Fail Data Collection Architecture for Cost Reduction. IEEE Trans. Very Large Scale Integr. Syst. 32 (6) (2024)
Youngkwang Lee, Donghyun Han, Sooryeong Lee, Sungho Kang
Novel Error-Tolerant Voltage-Divider-Based Through-Silicon-Via Test Architecture. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (1) (2023)
Seung Ho Shin, Hayoung Lee, Sooryeong Lee, Younwoo Yoo, Sungho Kang
An Improved Early Termination Methodology Using Convolutional Neural Network. ISOCC (2022)
Sooryeong Lee, Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
PROG: Per-Row Output Generator for BOST. ISOCC (2022)
Hayoung Lee, Sooryeong Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
FAME: Fault Address Memory Structure for Repair Time Reduction. ISOCC (2022)
Youngkwang Lee, Donghyun Han, Sooryeong Lee, Sungho Kang
A Circular-based TSV Repair Architecture. ISOCC (2021)
Donghyun Han, Youngkwang Lee, Sooryeong Lee, Sungho Kang
Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC. ISOCC (2021)