Donghyun Han

Publication Activity (10 Years)

Years Active: 2017-2023
Publications (10 Years): 16

Top Topics

Highly Reliable

Silicon Dioxide

Top Venues

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Youngkwang Lee, Donghyun Han, Sungho Kang
TSV Built-In Self-Repair Architecture for Improving the Yield and Reliability of HBM. IEEE Trans. Very Large Scale Integr. Syst. 31 (4) (2023)
Sunghoon Kim, Donghyun Han, Seokjun Jang, Sungho Kang
LOTS: Low Overhead TSV Repair Method Using IEEE-1838 Standard Architecture. ISOCC (2023)
Youngkwang Lee, Donghyun Han, Sooryeong Lee, Sungho Kang
Novel Error-Tolerant Voltage-Divider-Based Through-Silicon-Via Test Architecture. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (1) (2023)
Hogyeong Kim, Hayoung Lee, Donghyun Han, Sungho Kang
Multibank Optimized Redundancy Analysis Using Efficient Fault Collection. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (8) (2022)
Sangmin Park, Minho Cheong, Donghyun Han, Sungho Kang
Herringbone-Based TSV Architecture for Clustered Fault Repair and Aging Recovery. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (4) (2022)
Youngkwang Lee, Donghyun Han, Sooryeong Lee, Sungho Kang
A Circular-based TSV Repair Architecture. ISOCC (2021)
Donghyun Han, Hayoung Lee, Sungho Kang
Effective Spare Line Allocation Built-in Redundancy Analysis With Base Common Spare for Yield Improvement of 3D Memory. IEEE Access 9 (2021)
Donghyun Han, Youngkwang Lee, Sooryeong Lee, Sungho Kang
Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC. ISOCC (2021)
Youngki Moon, Hyunho Yoo, Donghyun Han, Sungho Kang
Area Efficient Built-In Redundancy Analysis using Pre-Solutions with Various Spare Structure. ISOCC (2021)
Donghyun Han, Hayoung Lee, Seungtaek Lee, Sungho Kang
ECC-Aware Fast and Reliable Pattern Matching Redundancy Analysis for Highly Reliable Memory. IEEE Access 9 (2021)
Hayoung Lee, Donghyun Han, Hogyeong Kim, Sungho Kang
W-ERA: One-Time Memory Repair with Wafer-Level Early Repair Analysis for Cost Reduction. ITC-Asia (2020)
Hayoung Lee, Donghyun Han, Hogyeong Kim, Sungho Kang
Redundancy Analysis Optimization with Clustered Known Solutions for High Speed Repair. ISOCC (2020)
Hayoung Lee, Donghyun Han, Seungtaek Lee, Sungho Kang
Dynamic Built-In Redundancy Analysis for Memory Repair. IEEE Trans. Very Large Scale Integr. Syst. 27 (10) (2019)
Hayoung Lee, Donghyun Han, Seungtaek Lee, Sungho Kang
Redundancy Analysis based on Fault Distribution for Memory with Complex Spares. ISOCC (2019)
Donghyun Han, Hayoung Lee, Seungtaek Lee, Minho Moon, Sungho Kang
3D Memory Formed of Unrepairable Memory Dice and Spare Layer. TENCON (2018)
Donghyun Han, Hayoung Lee, Donghyun Kim, Sungho Kang
A new repair scheme for TSV-based 3D memory using base die repair cells. ISOCC (2017)