Shin-Young Chung

Publication Activity (10 Years)

Years Active: 2019-2024
Publications (10 Years): 14

Top Topics

Reliability Assessment

Fault Isolation

Semiconductor Devices

Top Venues

Publications

Yinghong Zhao, Hokyung Park, Ki-Don Lee, Liangshan Chen, Manisha Sharma, Sugento Huandra, Hanson Mao, Brian Filemyr Smith, Wei Xia, Joonah Yoon, Junehwan Kim, Myungsoo Yeo, Shin-Young Chung, Ju Kwang Kim
Impacts of Post-Cu CMP Queue Time on Reliability. IRPS (2024)
Taiki Uemura, Byungjin Chung, Jaehee Choi, Seungbae Lee, Shin-Young Chung, Yuchul Hwang, Sangwoo Pae
Soft-Error Sensitivity in SRAM Manufactured by Bulk Gate-All-Around (GAA) Technology. IRPS (2024)
Taiki Uemura, Byungjin Chung, Jaehee Choi, Seungbae Lee, Shin-Young Chung, Yuchul Hwang, Sangwoo Pae
Comprehensive Study of SER in FDSOI-Planar: 28 nm to 18 nm Scaling Effect and Temperature Dependence. IRPS (2024)
Sangmin Oh, Taeyoung Jeong, Junghwan Yum, Minhyuk Lim, Yoohwan Kim, Bongyong Jeong, Jeongmin Jo, Hyewon Shim, Shin-Young Chung, Paul Jung
An Analysis of CDM-induced BTI-like Degradation using VF-TLP in Advanced FinFET Technology. IRPS (2024)
Rakesh Ranjan, Pavitra R. Perepa, Ki-Don Lee, Ashish Kumar Jha, Kartika C. Sahoo, Kayla N. Sanders, Robert Moeller, Prateek Sharma, Minhyo Kang, Peter Kim, Kwanjae Song, Yongwoo Jeon, Seungho Kim, Hyewon Shim, Shin-Young Chung, Ju Kwang Kim
A Systematic Study of HCI Improvement in FinFET with Source/Drain Implant and Geometry Modulation. IRPS (2024)
Manisha Sharma, Hokyung Park, Yinghong Zhao, Ki-Don Lee, Liangshan Chen, Joonah Yoon, Rakesh Ranjan, Caleb Dongkyan Kwon, Hyewon Shim, Myungsoo Yeo, Shin-Young Chung, Jon Haefner
Polarity Dependency of MOL-TDDB in FinFET. IRPS (2023)
SungMan Rhee, Hyunjin Kim, Sangku Park, Taiki Uemura, Yuchul Hwang, Seungjin Choo, Jinju Kim, Hwasung Rhee, Shin-Young Chung
Machine Learning Based V-ramp VBD Predictive Model Using OCD-measured Fab Parameters for Early Detection of MOL Reliability Risk. IRPS (2023)
Seongkyung Kim, Hyerim Park, Eunyu Choi, Young Han Kim, Dahyub Kim, Hyewon Shim, Shin-Young Chung, Paul Jung
Reliability Assessment of 3nm GAA Logic Technology Featuring Multi-Bridge-Channel FETs. IRPS (2023)
Rakesh Ranjan, Pavitra Ramadevi Perepa, Ki-Don Lee, Hokyung Park, Peter Kim, Ganesh Chakravarthy Yerubandi, Jon Haefner, Caleb Dongkyun Kwon, Minjung Jin, Wenhao Zhou, Hyewon Shim, Shin-Young Chung
Impact of Barrier Metal Thickness on SRAM Reliability. IRPS (2023)
Taiki Uemura, Byungjin Chung, Shin-Young Chung, Seungbae Lee, Yuchul Hwang, Sangwoo Pae
Impact of Design and Process on Alpha-Induced SER in 4 nm Bulk-FinFET SRAM. IRPS (2023)
Seongkyung Kim, Ukjin Jung, Seungjin Choo, Kihyun Choi, Tae-Jin Chung, Shin-Young Chung, Euncheol Lee, Juhun Park, Deokhan Bae, Myungyoon Um
Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology. IRPS (2022)
Taiki Uemura, Byungjin Chung, Jegon Kim, Hyewon Shim, Shin-Young Chung, Brandon Lee, Jaehee Choi, Shota Ohnishi, Ken Machida
Accelerator-Based Thermal-Neutron Beam by Compact and Low-Cost Moderator for Soft-Error Evaluation in Semiconductor Devices. IRPS (2022)
Taiki Uemura, Byungjin Chung, Jegon Kim, Hyewon Shim, Shin-Young Chung, Brandon Lee, Jaehee Choi, Shota Ohnishi, Ken Machida
Thermal-Neutron SER Mitigation by Cobalt-Contact in 7 nm Bulk-FinFET Technology. IRPS (2022)
Ghil-Geun Oh, Jong-Ho Eun, Shin-Young Chung, Brandon Lee
Advanded Design Verification and Debugging Techniques Based on Optical Fault Isolation Method. ISOCC (2019)