Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology.
Seongkyung KimUkjin JungSeungjin ChooKihyun ChoiTae-Jin ChungShin-Young ChungEuncheol LeeJuhun ParkDeokhan BaeMyungyoon UmPublished in: IRPS (2022)