Yasuhiro Take

Publication Activity (10 Years)

Years Active: 2011-2017
Publications (10 Years): 4

Top Topics

Distribution Network

Design Guidelines

Top Venues

IEICE Trans. Electron.

Publications

Masayuki Ikebe, Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Daisuke Uchida, Yasuhiro Take, Tadahiro Kuroda, Masato Motomura
An image sensor/processor 3D stacked module featuring ThruChip interfaces. ASP-DAC (2017)
Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Yasuhiro Take, Masayuki Ikebe, Tadahiro Kuroda, Masato Motomura
Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces. ESSCIRC (2016)
Takahiro Kagami, Hiroki Matsutani, Michihiro Koibuchi, Yasuhiro Take, Tadahiro Kuroda, Hideharu Amano
Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces. IEEE Trans. Very Large Scale Integr. Syst. 24 (2) (2016)
Li-Chung Hsu, Junichiro Kadomoto, So Hasegawa, Atsutake Kosuge, Yasuhiro Take, Tadahiro Kuroda
Analytical thruchip inductive coupling channel design optimization. ASP-DAC (2016)
Li-Chung Hsu, Junichiro Kadomoto, So Hasegawa, Atsutake Kosuge, Yasuhiro Take, Tadahiro Kuroda
A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel. IEICE Trans. Fundam. Electron. Commun. Comput. Sci. (12) (2015)
Masayuki Ikebe, Daisuke Uchida, Yasuhiro Take, Makito Someya, Satoshi Chikuda, Kento Matsuyama, Tetsuya Asai, Tadahiro Kuroda, Masato Motomura
Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer. VLSIC (2015)
Li-Chung Hsu, Masato Motomura, Yasuhiro Take, Tadahiro Kuroda
Through Chip Interface Based Three-Dimensional FPGA Architecture Exploration. IEICE Trans. Electron. (4) (2015)
Akira Okada, Abdul Raziz Junaidi, Yasuhiro Take, Atsutake Kosuge, Tadahiro Kuroda
Circuit and package design for 44GB/s inductive-coupling DRAM/SoC interface. ASP-DAC (2015)
Yasuhiro Take, Tadahiro Kuroda
Relay Transmission Thruchip Interface with Low-Skew 3D Clock Distribution Network. IEICE Trans. Electron. (4) (2015)
Li-Chung Hsu, Yasuhiro Take, Atsutake Kosuge, So Hasegawa, Junichiro Kadamoto, Tadahiro Kuroda
Design and analysis for ThruChip design for manufacturing (DFM). ASP-DAC (2015)
Abdul Raziz Junaidi, Yasuhiro Take, Tadahiro Kuroda
A 352Gb/s inductive-coupling DRAM/SoC interface using overlapping coils with phase division multiplexing and ultra-thin fan-out wafer level package. VLSIC (2014)
Yasuhiro Take, Hiroki Matsutani, Daisuke Sasaki, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano
3D NoC with Inductive-Coupling Links for Building-Block SiPs. IEEE Trans. Computers 63 (3) (2014)
Hiroki Matsutani, Michihiro Koibuchi, Ikki Fujiwara, Takahiro Kagami, Yasuhiro Take, Tadahiro Kuroda, Paul Bogdan, Radu Marculescu, Hideharu Amano
Low-latency wireless 3D NoCs via randomized shortcut chips. DATE (2014)
Noriyuki Miura, Yusuke Koizumi, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura
A Scalable 3D Heterogeneous Multicore with an Inductive ThruChip Interface. IEEE Micro 33 (6) (2013)
Noriyuki Miura, Yusuke Koizumi, Eiichi Sasaki, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura
A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface. COOL Chips (2013)
Hao Zhang, Hiroki Matsutani, Yasuhiro Take, Tadahiro Kuroda, Hideharu Amano
Vertical Link On/Off Regulations for Inductive-Coupling Based Wireless 3-D NoCs. IEICE Trans. Inf. Syst. (12) (2013)
Yasuhiro Take, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda
3D clock distribution using vertically/horizontally-coupled resonators. ISSCC (2013)
Yusuke Koizumi, Noriyuki Miura, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura
Demonstration of a heterogeneous multi-core processor with 3-D inductive coupling links. FPL (2013)
Hiroki Matsutani, Paul Bogdan, Radu Marculescu, Yasuhiro Take, Daisuke Sasaki, Hao Zhang, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano
A case for wireless 3D NoCs for CMPs. ASP-DAC (2013)
Noriyuki Miura, Yusuke Koizumi, Eiichi Sasaki, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura
A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface. Hot Chips Symposium (2013)
Andrzej Radecki, Yuxiang Yuan, Noriyuki Miura, Iori Aikawa, Yasuhiro Take, Hiroki Ishikuro, Tadahiro Kuroda
Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card. IEEE J. Solid State Circuits 47 (10) (2012)
Yasuhiro Take, Hayun Chung, Noriyuki Miura, Tadahiro Kuroda
Simultaneous data and power transmission using nested clover coils. ASP-DAC (2012)
Hao Zhang, Hiroki Matsutani, Yasuhiro Take, Tadahiro Kuroda, Hideharu Amano
Vertical Link On/Off Control Methods for Wireless 3-D NoCs. ARCS (2012)
Yusuke Koizumi, Eiichi Sasaki, Hideharu Amano, Hiroki Matsutani, Yasuhiro Take, Tadahiro Kuroda, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura
CMA-Cube: A scalable reconfigurable accelerator with 3-D wireless inductive coupling interconnect. FPL (2012)
Yasuhiro Take, Noriyuki Miura, Tadahiro Kuroda
Inductively-Coupled Injection-Locking CDR for High-Speed DRAM Interface. IEEE J. Solid State Circuits 46 (11) (2011)
Noriyuki Miura, Yasuhiro Take, Mitsuko Saito, Yoichi Yoshida, Tadahiro Kuroda
0.9pJ/b/chip 1coil/channel ThruChip interface with coupled-resonator-based CDR for NAND Flash memory stacking. ISSCC (2011)
Hiroki Matsutani, Yasuhiro Take, Daisuke Sasaki, Masayuki Kimura, Yuki Ono, Yukinori Nishiyama, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano
A vertical bubble flow network using inductive-coupling for 3-D CMPs. NOCS (2011)