Login / Signup

Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces.

Takahiro KagamiHiroki MatsutaniMichihiro KoibuchiYasuhiro TakeTadahiro KurodaHideharu Amano
Published in: IEEE Trans. Very Large Scale Integr. Syst. (2016)
Keyphrases