Yves Ousten

Publication Activity (10 Years)

Years Active: 2002-2018
Publications (10 Years): 2

Top Topics

Magnetic Resonance

Computer Integrated Manufacturing

Top Venues

Microelectron. Reliab.

Publications

Zaineb Jebri, Isabelle Bord-Majek, Celine Delafosse, Christophe Pasquet, Yves Ousten
A new non-magnetic trimmer for the magnetic resonance imaging system. MOCAST (2018)
M. Balmont, Isabelle Bord-Majek, B. Poupard, Laurent Béchou, Yves Ousten
Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability. Microelectron. Reliab. (2018)
Walide Chenniki, Isabelle Bord-Majek, Mélanie Louarn, Vincent Gaud, Jean-Luc Diot, Komkrisd Wongtimnoi, Yves Ousten
Liquid Crystal Polymer for QFN packaging: Predicted thermo-mechanical fatigue and Design for Reliability. Microelectron. Reliab. 55 (12) (2015)
Raphael Baillot, Yannick Deshayes, Yves Ousten, Laurent Béchou
Photothermal activated failure mechanism in polymer-based packaging of low power InGaN/GaN MQW LED under active storage. Microelectron. Reliab. 55 (9-10) (2015)
Amadou Sow, Sinivassane Somaya, Yves Ousten, Jean-Michel Vinassa, Fanny Patoureaux
Power MOSFET active power cycling for medical system reliability assessment. Microelectron. Reliab. 53 (9-11) (2013)
Piero Spezzigu, Laurent Béchou, Gianandrea Quadri, Olivier Gilard, Yves Ousten, Massimo Vanzi
An original DoE-based tool for silicon photodetectors EoL estimation in space environments. Microelectron. Reliab. 51 (9-11) (2011)
Raphael Baillot, Yannick Deshayes, Laurent Béchou, T. Buffeteau, I. Pianet, C. Armand, F. Voillot, S. Sorieul, Yves Ousten
Effects of silicone coating degradation on GaN MQW LEDs performances using physical and chemical analyses. Microelectron. Reliab. 50 (9-11) (2010)
M. L. Bourqui, Laurent Béchou, Olivier Gilard, Yannick Deshayes, Pamela Del Vecchio, L. S. How, F. Rosala, Yves Ousten, André Touboul
Reliability investigations of 850 nm silicon photodiodes under proton irradiation for space applications. Microelectron. Reliab. 48 (8-9) (2008)
Yannick Deshayes, Isabelle Bord-Majek, G. Barreau, M. Aiche, P. H. Moretto, Laurent Béchou, A. C. Roehrig, Yves Ousten
Selective activation of failure mechanisms in packaged double-heterostructure light emitting diodes using controlled neutron energy irradiation. Microelectron. Reliab. 48 (8-9) (2008)
V. Krieger, Wolfgang Wondrak, A. Dehbi, W. Bartel, Yves Ousten, Bruno Levrier
Defect detection in multilayer ceramic capacitors. Microelectron. Reliab. 46 (9-11) (2006)
Jean Augereau, Yves Ousten, Bruno Levrier, Laurent Béchou
Use of signal processing imaging for the study of a 3D package in harsh environment. Microelectron. Reliab. 46 (9-11) (2006)
A. Dehbi, Yves Ousten, Yves Danto, Wolfgang Wondrak
Vibration lifetime modelling of PCB assemblies using steinberg model. Microelectron. Reliab. 45 (9-11) (2005)
H. A. Post, P. Letullier, T. Briolat, R. Humke, R. Schuhmann, K. Saarinen, W. Werner, Yves Ousten, G. Lekens, A. Dehbi
Failure mechanisms and qualification testing of passive components. Microelectron. Reliab. 45 (9-11) (2005)
Geneviève Duchamp, Frédéric Verdier, Yannick Deshayes, François Marc, Yves Ousten, Yves Danto
Reliability of Low-Cost PCB Interconnections for Telecommunication Applications. Microelectron. Reliab. 44 (9-11) (2004)
Laurent Béchou, Dominique Dallet, Yves Danto, Pasquale Daponte, Yves Ousten, Sergio Rapuano
An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy. IEEE Trans. Instrum. Meas. 52 (1) (2003)
G. Andriamonje, Vincent Pouget, Yves Ousten, Dean Lewis, Yves Danto, Jean-Michel Rampnoux, Younès Ezzahri, Stefan Dilhaire, Stéphane Grauby, Wilfrid Claeys
Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits. Microelectron. Reliab. 43 (9-11) (2003)
Geneviève Duchamp, Yves Ousten, Yves Danto
Evaluation of a micropackaging analysis technique by highfrequency microwaves. Microelectron. Reliab. 42 (9-11) (2002)
Jean Augereau, Yves Ousten, Laurent Béchou, Yves Danto
Acoustic analysis of an assembly: Structural identification by signal processing (wavelets). Microelectron. Reliab. 42 (9-11) (2002)
B. Trégon, Yves Ousten, Yves Danto, Laurent Béchou, B. Parmentier
Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions. Microelectron. Reliab. 42 (7) (2002)
A. Dehbi, Wolfgang Wondrak, Yves Ousten, Yves Danto
High temperature reliability testing of aluminum and tantalum electrolytic capacitors. Microelectron. Reliab. 42 (6) (2002)