Samson Melamed

Publication Activity (10 Years)

Years Active: 2006-2017
Publications (10 Years): 2

Top Topics

Integrated Circuit

Topology Preserving

High Definition

Dynamically Changing

Top Venues

Microelectron. Reliab.

Microelectron. J.

IET Circuits Devices Syst.

Publications

Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits. Microelectron. Reliab. 79 (2017)
Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi
Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits. Microelectron. Reliab. 67 (2016)
Samson Melamed, Katsuya Kikuchi, Masahiro Aoyagi
Investigation of effects of metalization on heat spreading in bump-bonded 3D systems. 3DIC (2015)
Samson Melamed, Fumito Imura, Hiroshi Nakagawa, Katsuya Kikuchi, Michiya Hagimoto, Yukoh Matsumoto, Masahiro Aoyagi
Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit. Microelectron. J. 46 (12) (2015)
Shivam Priyadarshi, T. Robert Harris, Samson Melamed, Carlos Tadeo Ortega Otero, Nikhil Kriplani, Carlos E. Christoffersen, Rajit Manohar, Steven R. Dooley, W. Rhett Davis, Paul D. Franzon, Michael B. Steer
Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels. IET Circuits Devices Syst. 6 (1) (2012)
Samson Melamed, Thorlindur Thorolfsson, T. Robert Harris, Shivam Priyadarshi, Paul D. Franzon, Michael B. Steer, W. Rhett Davis
Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31 (5) (2012)
Paul D. Franzon, W. Rhett Davis, Thorlindur Thorolfsson, Samson Melamed
3D Specific Systems: Design and CAD. Asian Test Symposium (2011)
Shivam Priyadarshi, Jianchen Hu, Won Ha Choi, Samson Melamed, Xi Chen, W. Rhett Davis, Paul D. Franzon
Pathfinder 3D: A flow for system-level design space exploration. 3DIC (2011)
Paul D. Franzon, W. Rhett Davis, Thorlindur Thorolfsson, Samson Melamed
3D specific systems design and CAD. ICSAMOS (2011)
Thorlindur Thorolfsson, Samson Melamed, W. Rhett Davis, Paul D. Franzon
Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration. ACM Trans. Design Autom. Electr. Syst. 16 (1) (2010)
Thorlindur Thorolfsson, Samson Melamed, Gary Charles, Paul D. Franzon
Comparative analysis of two 3D integration implementations of a SAR processor. 3DIC (2009)
Samson Melamed, Thorlindur Thorolfsson, Adi Srinivasan, Edmund Cheng, Paul D. Franzon, William Rhett Davis
Junction-level thermal extraction and simulation of 3DICs. 3DIC (2009)
Paul D. Franzon, W. Rhett Davis, Michael B. Steer, Steve Lipa, Eun Chu Oh, Thorlindur Thorolfsson, Samson Melamed, Sonali Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller
Design and CAD for 3D integrated circuits. DAC (2008)
Christopher Mineo, Ravi Jenkal, Samson Melamed, W. Rhett Davis
Inter-die signaling in three dimensional integrated circuits. CICC (2008)
Hao Hua, Christopher Mineo, Kory Schoenfliess, Ambarish M. Sule, Samson Melamed, Ravi Jenkal, W. Rhett Davis
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits. DAC (2006)