Steve Lipa

Publication Activity (10 Years)

Years Active: 2001-2022
Publications (10 Years): 3

Top Topics

Database Administrators

Multi Core Processors

Parallel Algorithm

Top Venues

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Theodros Nigussie, Joshua Schabel, Steve Lipa, Lisa G. McIlrath, Robert Patti, Paul D. Franzon
Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning. IEEE Trans. Very Large Scale Integr. Syst. 30 (9) (2022)
Vinesh Srinivasan, Rangeen Basu Roy Chowdhury, Elliott Forbes, Randy Widialaksono, Zhenqian Zhang, Joshua Schabel, Sungkwan Ku, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon
H3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor. ICCD (2017)
Randy Widialaksono, Rangeen Basu Roy Chowdhury, Zhenqian Zhang, Joshua Schabel, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon
Physical design of a 3D-stacked heterogeneous multi-core processor. 3DIC (2016)
Paul D. Franzon, Eric Rotenberg, James Tuck, W. Rhett Davis, Huiyang Zhou, Joshua Schabel, Zhenqian Zhang, J. Brandon Dwiel, Elliott Forbes, Joonmoo Huh, Steve Lipa
Computing in 3D. CICC (2015)
Paul D. Franzon, Eric Rotenberg, James Tuck, W. Rhett Davis, Huiyang Zhou, Joshua Schabel, Zhenqian Zhang, J. Brandon Dwiel, Elliott Forbes, Joonmoo Huh, Marcus Tshibangu, Steve Lipa
Computing in 3D. 3DIC (2015)
Elliott Forbes, Zhenqian Zhang, Randy Widialaksono, Brandon H. Dwiel, Rangeen Basu Roy Chowdhury, Vinesh Srinivasan, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon
Under 100-cycle thread migration latency in a single-ISA heterogeneous multi-core processor. Hot Chips Symposium (2015)
Paul D. Franzon, Eric Rotenberg, James Tuck, Huiyang Zhou, W. Rhett Davis, Hongwen Dai, Joonmoo Huh, Sungkwan Ku, Steve Lipa, Chao Li, Jong Beom Park, Joshua Schabel
3D-enabled customizable embedded computer (3DECC). 3DIC (2014)
Paul D. Franzon, Shivam Priyadarshi, Steve Lipa, W. Rhett Davis, Thorlindur Thorolfsson
Exploring early design tradeoffs in 3DIC. ISCAS (2013)
Eric Rotenberg, Brandon H. Dwiel, Elliott Forbes, Zhenqian Zhang, Randy Widialaksono, Rangeen Basu Roy Chowdhury, Nyunyi M. Tshibangu, Steve Lipa, W. Rhett Davis, Paul D. Franzon
Rationale for a 3D heterogeneous multi-core processor. ICCD (2013)
Thorlindur Thorolfsson, Steve Lipa, Paul D. Franzon
A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration. CICC (2012)
Steve Lipa, Thorlindur Thorolfsson, Paul D. Franzon
The NCSU Tezzaron design kit. 3DIC (2010)
Paul D. Franzon, W. Rhett Davis, Michael B. Steer, Steve Lipa, Eun Chu Oh, Thorlindur Thorolfsson, Samson Melamed, Sonali Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller
Design and CAD for 3D integrated circuits. DAC (2008)
John Wood, Terence C. Edwards, Steve Lipa
Rotary traveling-wave oscillator arrays: a new clock technology. IEEE J. Solid State Circuits 36 (11) (2001)