Robert Patti

Publication Activity (10 Years)

Years Active: 2011-2023
Publications (10 Years): 4

Top Topics

Transmission Electron Microscopy

Integrated Circuit

Multi Core Architecture

Top Venues

VLSI Technology and Circuits

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Po-Hsuan Chang, Anirban Samanta, Peng Yan, Mingye Fu, Yu Zhang, Mehmet Berkay On, Ankur Kumar, Hyungryul Kang, Il-Min Yi, Dedeepya Annabattuni, David Scott, Robert Patti, Yang-Hang Fan, Yuanming Zhu, S. J. Ben Yoo, Samuel Palermo
A Sub-500fJ/bit 3D Direct Bond Silicon Photonic Transceiver in 12nm FinFET. VLSI Technology and Circuits (2023)
Anirban Samanta, Po-Hsuan Chang, Peng Yan, Mingye Fu, Mehmet Berkay On, Ankur Kumar, Hyungryul Kang, Il-Min Yi, Dedeepya Annabattuni, Yu Zhang, David Scott, Robert Patti, Yang-Hang Fan, Yuanming Zhu, Samuel Palermo, S. J. Ben Yoo
A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit. OFC (2023)
Theodros Nigussie, Joshua Schabel, Steve Lipa, Lisa G. McIlrath, Robert Patti, Paul D. Franzon
Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning. IEEE Trans. Very Large Scale Integr. Syst. 30 (9) (2022)
Lee Baker, Robert Patti, Paul D. Franzon
Multi-ANN embedded system based on a custom 3D-DRAM. 3DIC (2021)
Robert Patti
Invited talk: Progress in 3D integrated circuits. 3DIC (2015)
Bharan Giridhar, Michael Cieslak, Deepankar Duggal, Ronald G. Dreslinski, Hsing Min Chen, Robert Patti, Betina Hold, Chaitali Chakrabarti, Trevor N. Mudge, David T. Blaauw
Exploring DRAM organizations for energy-efficient and resilient exascale memories. SC (2013)
Robert Patti
3D integrated circuits: Designing in a new dimension: Designer track. ICCAD (2012)
Robert Patti
Advances in 3D integrated circuits. ISPD (2011)
Joseph Romen Cubillo, Roshan Weerasekera, Zaw Zaw Oo, En-Xiao Liu, Bob Conn, Surya Bhattacharya, Robert Patti
Interconnect design and analysis for Through Silicon Interposers (TSIs). 3DIC (2011)