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A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit.

Anirban SamantaPo-Hsuan ChangPeng YanMingye FuMehmet Berkay OnAnkur KumarHyungryul KangIl-Min YiDedeepya AnnabattuniYu ZhangDavid ScottRobert PattiYang-Hang FanYuanming ZhuSamuel PalermoS. J. Ben Yoo
Published in: OFC (2023)
Keyphrases
  • high speed
  • transmission electron microscopy
  • sensitivity analysis
  • low cost
  • cmos technology
  • frequency response
  • high density
  • high sensitivity
  • real time
  • low power
  • power dissipation
  • wireless systems