Randy Widialaksono

Publication Activity (10 Years)

Years Active: 2013-2017
Publications (10 Years): 4

Top Topics

Measurement Errors

Physical Design

Multi Core Processors

Top Venues

Hot Chips Symposium

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

Publications

Vinesh Srinivasan, Rangeen Basu Roy Chowdhury, Elliott Forbes, Randy Widialaksono, Zhenqian Zhang, Joshua Schabel, Sungkwan Ku, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon
H3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor. ICCD (2017)
Randy Widialaksono, Rangeen Basu Roy Chowdhury, Zhenqian Zhang, Joshua Schabel, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon
Physical design of a 3D-stacked heterogeneous multi-core processor. 3DIC (2016)
Mukesh Agrawal, Krishnendu Chakrabarty, Randy Widialaksono
Reuse-Based Optimization for Prebond and Post-Bond Testing of 3-D-Stacked ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34 (1) (2015)
Elliott Forbes, Zhenqian Zhang, Randy Widialaksono, Brandon H. Dwiel, Rangeen Basu Roy Chowdhury, Vinesh Srinivasan, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon
Under 100-cycle thread migration latency in a single-ISA heterogeneous multi-core processor. Hot Chips Symposium (2015)
Randy Widialaksono, Wenxu Zhao, W. Rhett Davis, Paul D. Franzon
Leveraging 3D-IC for on-chip timing uncertainty measurements. 3DIC (2014)
Eric Rotenberg, Brandon H. Dwiel, Elliott Forbes, Zhenqian Zhang, Randy Widialaksono, Rangeen Basu Roy Chowdhury, Nyunyi M. Tshibangu, Steve Lipa, W. Rhett Davis, Paul D. Franzon
Rationale for a 3D heterogeneous multi-core processor. ICCD (2013)