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Exploring compromises among timing, power and temperature in three-dimensional integrated circuits.
Hao Hua
Christopher Mineo
Kory Schoenfliess
Ambarish M. Sule
Samson Melamed
Ravi Jenkal
W. Rhett Davis
Published in:
DAC (2006)
Keyphrases
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integrated circuit
three dimensional
electrical power
d objects
multi view
human body
power consumption
surface reconstruction
virtual reality
image sequences
depth map
electron beam
temperature control
range images
computer vision
printed circuit boards
power management
high temperature
surface temperature