C
search
search
reviewers
reviewers
feeds
feeds
assignments
assignments
settings
logout
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits.
Samson Melamed
Naoya Watanabe
Shunsuke Nemoto
Haruo Shimamoto
Katsuya Kikuchi
Masahiro Aoyagi
Published in:
Microelectron. Reliab. (2017)
Keyphrases
</>
integrated circuit
three dimensional
infrared
preprocessing
topological properties
range images
human body
visible spectrum
electron beam
printed circuit boards
topology preserving
virtual reality
binary images
power system
data sets
x ray
multi view
low cost
object recognition
image sequences
image processing