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Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits.
Samson Melamed
Naoya Watanabe
Shunsuke Nemoto
Haruo Shimamoto
Katsuya Kikuchi
Masahiro Aoyagi
Published in:
Microelectron. Reliab. (2017)
Keyphrases
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integrated circuit
three dimensional
infrared
preprocessing
topological properties
range images
human body
visible spectrum
electron beam
printed circuit boards
topology preserving
virtual reality
binary images
power system
data sets
x ray
multi view
low cost
object recognition
image sequences
image processing