Shunsuke Nemoto

Publication Activity (10 Years)

Years Active: 2006-2017
Publications (10 Years): 2

Top Topics

Integrated Circuit

Three Dimensional

Topology Preserving

Magnetic Recording

Top Venues

Microelectron. Reliab.

Publications

Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits. Microelectron. Reliab. 79 (2017)
Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi
Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits. Microelectron. Reliab. 67 (2016)
Katsuya Kikuchi, Fumiki Kato, Shunsuke Nemoto, Hiroshi Nakagawa, Masahiro Aoyagi, Youtaro Yasu, Kohji Koshiji
Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging. 3DIC (2013)
Masahiro Aoyagi, Naoya Watanabe, Motohiro Suzuki, Katsuya Kikuchi, Shunsuke Nemoto, Noriaki Arima, Misaki Ishizuka, Koji Suzuki, Toshio Shiomi
New optical three dimensional structure measurement method of cone shape micro bumps used for 3D LSI chip stacking. 3DIC (2013)
Hiroo Sekiya, Shunsuke Nemoto, Jianming Lu, Takashi Yahagi
Phase control for resonant DC-DC converter with class-DE inverter and class-E rectifier. IEEE Trans. Circuits Syst. I Regul. Pap. (2) (2006)