New optical three dimensional structure measurement method of cone shape micro bumps used for 3D LSI chip stacking.
Masahiro AoyagiNaoya WatanabeMotohiro SuzukiKatsuya KikuchiShunsuke NemotoNoriaki ArimaMisaki IshizukaKoji SuzukiToshio ShiomiPublished in: 3DIC (2013)