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Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging.
Katsuya Kikuchi
Fumiki Kato
Shunsuke Nemoto
Hiroshi Nakagawa
Masahiro Aoyagi
Youtaro Yasu
Kohji Koshiji
Published in:
3DIC (2013)
Keyphrases
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high density
low density
high speed
data center
thin film
close proximity
high power
design process
high bandwidth
magnetic tape
case study
magnetic recording
physical design
steady state
database systems
information retrieval
database