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Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits.
Samson Melamed
Naoya Watanabe
Shunsuke Nemoto
Haruo Shimamoto
Katsuya Kikuchi
Masahiro Aoyagi
Published in:
Microelectron. Reliab. (2016)
Keyphrases
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integrated circuit
three dimensional
preprocessing
x ray
edge detection
multi view
topology preserving
electron beam
data sets
image analysis
d objects
human body
medial axis
visual inspection
printed circuit boards
solder ball connect