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Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit.

Samson MelamedFumito ImuraHiroshi NakagawaKatsuya KikuchiMichiya HagimotoYukoh MatsumotoMasahiro Aoyagi
Published in: Microelectron. J. (2015)
Keyphrases
  • high speed
  • infrared
  • data sets
  • preprocessing
  • topological properties
  • multiscale
  • database
  • real time
  • search engine
  • evolutionary algorithm
  • medial axis
  • thinning algorithm
  • heat transfer
  • delay insensitive
  • logic synthesis