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T. Robert Harris
Publication Activity (10 Years)
Years Active: 2010-2023
Publications (10 Years): 2
Top Topics
Infrared
Integrated Circuit
Low Cost
Integrating Heterogeneous
Top Venues
3DIC
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Publications
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Erik W. Masselink
,
Andrew Stark
,
Benjamin B. Yang
,
T. Robert Harris
Review of Hybrid Integration Techniques for Integrating III-V Onta Silicon.
3DIC
(2023)
T. Robert Harris
,
W. Rhett Davis
,
Steven Lipa
,
W. Shepherd Pitts
,
Paul D. Franzon
Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages.
3DIC
(2019)
Eric J. Wyers
,
T. Robert Harris
,
Wallace Shep Pitts
,
Jordan E. Massad
,
Paul D. Franzon
Characterization of the mechanical stress impact on device electrical performance in the CMOS and III-V HEMT/HBT heterogeneous integration environment.
3DIC
(2015)
T. Robert Harris
,
Eric J. Wyers
,
Lee Wang
,
Samuel Graham
,
Georges Pavlidis
,
Paul D. Franzon
,
W. Rhett Davis
Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks.
3DIC
(2015)
T. Robert Harris
,
Paul D. Franzon
,
W. Rhett Davis
,
Lee Wang
Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits.
3DIC
(2014)
Shivam Priyadarshi
,
T. Robert Harris
,
Samson Melamed
,
Carlos Tadeo Ortega Otero
,
Nikhil Kriplani
,
Carlos E. Christoffersen
,
Rajit Manohar
,
Steven R. Dooley
,
W. Rhett Davis
,
Paul D. Franzon
,
Michael B. Steer
Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels.
IET Circuits Devices Syst.
6 (1) (2012)
Samson Melamed
,
Thorlindur Thorolfsson
,
T. Robert Harris
,
Shivam Priyadarshi
,
Paul D. Franzon
,
Michael B. Steer
,
W. Rhett Davis
Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
31 (5) (2012)
Shivam Priyadarshi
,
Nikhil Kriplani
,
Michael B. Steer
,
T. Robert Harris
Fast dynamic simulation of VLSI circuits using reduced order compact macromodel of standard cells.
BMAS
(2010)