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Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits.

T. Robert HarrisPaul D. FranzonW. Rhett DavisLee Wang
Published in: 3DIC (2014)
Keyphrases
  • integrated circuit
  • wide variety
  • highly heterogeneous
  • input output
  • electron beam
  • real world
  • data sets
  • infrared
  • finite element analysis