Lingjun Zhu

Publication Activity (10 Years)

Years Active: 2013-2024
Publications (10 Years): 31

Top Topics

Distributed Heterogeneous

Compute Intensive

Tightly Coupled

Physical Design

Top Venues

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim
A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping. IEEE Trans. Very Large Scale Integr. Syst. 32 (3) (2024)
Weidong Zhang, Erci Xu, Qiuping Wang, Xiaolu Zhang, Yuesheng Gu, Zhenwei Lu, Tao Ouyang, Guanqun Dai, Wenwen Peng, Zhe Xu, Shuo Zhang, Dong Wu, Yilei Peng, Tianyun Wang, Haoran Zhang, Jiasheng Wang, Wenyuan Yan, Yuanyuan Dong, Wenhui Yao, Zhongjie Wu, Lingjun Zhu, Chao Shi, Yinhu Wang, Rong Liu, Junping Wu, Jiaji Zhu, Jiesheng Wu
What's the Story in EBS Glory: Evolutions and Lessons in Building Cloud Block Store. FAST (2024)
Xuzheng Chen, Jie Zhang, Ting Fu, Yifan Shen, Shu Ma, Kun Qian, Lingjun Zhu, Chao Shi, Ming Liu, Zeke Wang
Demystifying Datapath Accelerator Enhanced Off-path SmartNIC. CoRR (2024)
Kaihui Gao, Chen Sun, Shuai Wang, Dan Li, Yu Zhou, Hongqiang Harry Liu, Lingjun Zhu, Ming Zhang, Xiang Deng, Cheng Zhou, Lu Lu
Buffer-Based High-Coverage and Low-Overhead Request Event Monitoring in the Cloud. IEEE/ACM Trans. Netw. 31 (4) (2023)
Gauthaman Murali, Aditya Iyer, Lingjun Zhu, Jianming Tong, Francisco Muñoz-Martínez, Srivatsa Rangachar Srinivasa, Tanay Karnik, Tushar Krishna, Sung Kyu Lim
On Continuing DNN Accelerator Architecture Scaling Using Tightly Coupled Compute-on-Memory 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 31 (10) (2023)
Sandra Maria Shaji, Lingjun Zhu, Jun-Sik Yoon, Sung Kyu Lim
A Comparative Study on Front-Side, Buried and Back-Side Power Rail Topologies in 3nm Technology Node. ISLPED (2023)
Lingjun Zhu, Sung Kyu Lim
INVITED: Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps. DAC (2023)
Menghan Hu, Qingyi Zhu, Lingjun Zhu
What are the actual needs of visually impaired people? Displays 78 (2023)
Jie Zhang, Hongjing Huang, Lingjun Zhu, Shu Ma, Dazhong Rong, Yijun Hou, Mo Sun, Chaojie Gu, Peng Cheng, Chao Shi, Zeke Wang
SmartDS: Middle-Tier-centric SmartNIC Enabling Application-aware Message Split for Disaggregated Block Storage. ISCA (2023)
Pruek Vanna-Iampikul, Lingjun Zhu, Serhat Erdogan, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Sung Kyu Lim
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. DAC (2023)
Lingjun Zhu, Yifan Shen, Erci Xu, Bo Shi, Ting Fu, Shu Ma, Shuguang Chen, Zhongyu Wang, Haonan Wu, Xingyu Liao, Zhendan Yang, Zhongqing Chen, Wei Lin, Yijun Hou, Rong Liu, Chao Shi, Jiaji Zhu, Jiesheng Wu
Deploying User-space TCP at Cloud Scale with LUNA. USENIX Annual Technical Conference (2023)
Lingjun Zhu, Nesara Eranna Bethur, Yi-Chen Lu, Youngsang Cho, Yunhyeok Im, Sung Kyu Lim
3D IC Tier Partitioning of Memory Macros: PPA vs. Thermal Tradeoffs. ISLPED (2022)
Lingjun Zhu, Arjun Chaudhuri, Sanmitra Banerjee, Gauthaman Murali, Pruek Vanna-Iampikul, Krishnendu Chakrabarty, Sung Kyu Lim
Design Automation and Test Solutions for Monolithic 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 18 (1) (2022)
Rui Miao, Lingjun Zhu, Shu Ma, Kun Qian, Shujun Zhuang, Bo Li, Shuguang Cheng, Jiaqi Gao, Yan Zhuang, Pengcheng Zhang, Rong Liu, Chao Shi, Binzhang Fu, Jiaji Zhu, Jiesheng Wu, Dennis Cai, Hongqiang Harry Liu
From luna to solar: the evolutions of the compute-to-storage networks in Alibaba cloud. SIGCOMM (2022)
Yi-Chen Lu, Sai Pentapati, Lingjun Zhu, Gauthaman Murali, Kambiz Samadi, Sung Kyu Lim
A Machine Learning-Powered Tier Partitioning Methodology for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (11) (2022)
Kaihui Gao, Chen Sun, Shuai Wang, Dan Li, Yu Zhou, Hongqiang Harry Liu, Lingjun Zhu, Ming Zhang
Buffer-based End-to-end Request Event Monitoring in the Cloud. NSDI (2022)
Lingjun Zhu, Xiaodong Wang, Tania Akter Asa, Md. Ali Hossain
Identification of key genes, pathways, and associated comorbidities in chikungunya infection: insights from system biology analysis. Netw. Model. Anal. Health Informatics Bioinform. 10 (1) (2021)
Jan Moritz Joseph, Ananda Samajdar, Lingjun Zhu, Rainer Leupers, Sung Kyu Lim, Thilo Pionteck, Tushar Krishna
Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators. ISQED (2021)
Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim
Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options. DAC (2021)
Lingjun Zhu, Sung Kyu Lim
Physical Design Challenges and Solutions for Emerging Heterogeneous 3D Integration Technologies. ISPD (2021)
Lingjun Zhu, Lennart Bamberg, Sai Surya Kiran Pentapati, Kyungwook Chang, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Brian Cline, Saurabh Sinha, Xiaoqing Xu, Alberto García-Ortiz, Sung Kyu Lim
High-Performance Logic-on-Memory Monolithic 3-D IC Designs for Arm Cortex-A Processors. IEEE Trans. Very Large Scale Integr. Syst. 29 (6) (2021)
Lingjun Zhu, Tuan Ta, Rossana Liu, Rahul Mathur, Xiaoqing Xu, Shidhartha Das, Ankit Kaul, Alejandro Rico, Doug Joseph, Brian Cline, Sung Kyu Lim
Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture. ISLPED (2021)
Lingjun Zhu, Kyungwook Chang, Dusan Petranovic, Saurabh Sinha, Yun Seop Yu, Sung Kyu Lim
Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs. ISPD (2020)
Jan Moritz Joseph, Ananda Samajdar, Lingjun Zhu, Rainer Leupers, Sung Kyu Lim, Thilo Pionteck, Tushar Krishna
Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators. CoRR (2020)
Yi-Chen Lu, Sai Surya Kiran Pentapati, Lingjun Zhu, Kambiz Samadi, Sung Kyu Lim
TP-GNN: A Graph Neural Network Framework for Tier Partitioning in Monolithic 3D ICs. DAC (2020)
Fares Elsabbagh, Blaise Tine, Priyadarshini Roshan, Ethan Lyons, Euna Kim, Da Eun Shim, Lingjun Zhu, Sung Kyu Lim, Hyesoon Kim
Vortex: OpenCL Compatible RISC-V GPGPU. CoRR (2020)
Lennart Bamberg, Alberto García Ortiz, Lingjun Zhu, Sai Pentapati, Da Eun Shim, Sung Kyu Lim
Macro-3D: A Physical Design Methodology for Face-to-Face-Stacked Heterogeneous 3D ICs. DATE (2020)
Lingjun Zhu, Lennart Bamberg, Anthony Agnesina, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Julien Ryckaert, Alberto García-Ortiz, Sung Kyu Lim
Heterogeneous 3D Integration for a RISC-V System With STT-MRAM. IEEE Comput. Archit. Lett. 19 (1) (2020)
Yu Zhou, Chen Sun, Hongqiang Harry Liu, Rui Miao, Shi Bai, Bo Li, Zhilong Zheng, Lingjun Zhu, Zhen Shen, Yongqing Xi, Pengcheng Zhang, Dennis Cai, Ming Zhang, Mingwei Xu
Flow Event Telemetry on Programmable Data Plane. SIGCOMM (2020)
Lingjun Zhu
The Financial Archives Management System of University Based on Computer Network Technology. CSIA (2) (2020)
Sai Pentapati, Lingjun Zhu, Lennart Bamberg, Da Eun Shim, Alberto García Ortiz, Sung Kyu Lim
A Logic-on-Memory Processor-System Design With Monolithic 3-D Technology. IEEE Micro 39 (6) (2019)
Huipeng Chen, Lingjun Zhu, Xiaofan Liu, Sunan Yu, Dingcheng Zhao
Study on Steering by Wire Controller Based on Improved H∞ Algorithm. Int. J. Online Eng. 9 (S2) (2013)