Pruek Vanna-Iampikul

Publication Activity (10 Years)

Years Active: 2020-2024
Publications (10 Years): 9

Top Topics

Physical Design

Top Venues

ACM Trans. Design Autom. Electr. Syst.

Publications

Hao-Hsiang Hsiao, Yi-Chen Lu, Pruek Vanna-Iampikul, Sung Kyu Lim
FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning. ISPD (2024)
Jeffrey S. Vetter, Prasanna Date, Farah Fahim, Shruti R. Kulkarni, Petro Maksymovych, A. Alec Talin, Marc González Tallada, Pruek Vanna-Iampikul, Aaron R. Young, David Brooks, Yu Cao, Gu-Yeon Wei, Sung Kyu Lim, Frank Liu, Matthew J. Marinella, Bobby G. Sumpter, Narasinga Rao Miniskar
Abisko: Deep codesign of an architecture for spiking neural networks using novel neuromorphic materials. Int. J. High Perform. Comput. Appl. 37 (3-4) (2023)
Narasinga Rao Miniskar, Pruek Vanna-Iampikul, Aaron R. Young, Sung Kyu Lim, Frank Liu, Jieun Yoo, Corrinne Mills, Nhan Tran, Farah Fahim, Jeffrey S. Vetter
A 3D Implementation of Convolutional Neural Network for Fast Inference. ISCAS (2023)
Pruek Vanna-Iampikul, Yi-Chen Lu, Da Eun Shim, Sung Kyu Lim
GNN-based Multi-bit Flip-flop Clustering and Post-clustering Design Optimization for Energy-efficient 3D ICs. ACM Trans. Design Autom. Electr. Syst. 28 (5) (2023)
Pruek Vanna-Iampikul, Lingjun Zhu, Serhat Erdogan, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Sung Kyu Lim
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. DAC (2023)
Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Yun Heo, Jae-Seung Choi, Sung Kyu Lim
Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (7) (2023)
Lingjun Zhu, Arjun Chaudhuri, Sanmitra Banerjee, Gauthaman Murali, Pruek Vanna-Iampikul, Krishnendu Chakrabarty, Sung Kyu Lim
Design Automation and Test Solutions for Monolithic 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 18 (1) (2022)
Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Sung Kyu Lim
Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs. ISPD (2021)
Jinwoo Kim, Gauthaman Murali, Pruek Vanna-Iampikul, Edward Lee, Daehyun Kim, Arjun Chaudhuri, Sanmitra Banerjee, Krishnendu Chakrabarty, Saibal Mukhopadhyay, Sung Kyu Lim
RTL-to-GDS Design Tools for Monolithic 3D ICs. ICCAD (2020)